SCHEMBL3799398

SCHEMBL3799398

[C-]#N.[Tl+]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4885542 0.75
SCHEMBL4885300 0.75
SCHEMBL314258 0.75
SCHEMBL352283 0.75
SCHEMBL10920727 0.75
SCHEMBL5152734 0.75 CA1 (0.60)
Potassium Ion SCHEMBL1284 0.75
Potassium Ion SCHEMBL1332472 0.75
Potassium Ion SCHEMBL1331713 0.75
SCHEMBL147247 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115418508-B Enrichment extraction process of thallium in zinc hydrometallurgy process 西北矿冶研究院 2023-11-07 CN disclosed
CN-115418508-A Enrichment extraction process of thallium in zinc hydrometallurgy process 西北矿冶研究院 2022-12-02 CN disclosed
US-7662355-B2 Silicon nanosized linear body and a method for producing a silicon nanosized linear body NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY (JP) 2010-02-16 US disclosed
US-20080044336-A1 Silicon Nanosized Linear Body and a Method for Producing a Silicon Nanosized Linear Body NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY (JP) 2008-02-21 US disclosed
US-20060281948-A1 Process for preparing substituted benzoyl cyanides SALTIGO GMBH 2006-12-14 US disclosed
US-6991675-B2 Electroless displacement gold plating solution and additive for use in preparing plating solution SHIPLEY COMPANY, L.L.C. (US) 2006-01-31 US disclosed
US-20050031895-A1 Electroless displacement gold plating solution and additive for use in preparing plating solution SHIPLEY COMPANY, L.L.C. 2005-02-10 US disclosed
EP-1327700-A1 ELECTROLESS DISPLACEMENT GOLD PLATING SOLUTION AND ADDITIVE FOR PREPARING SAID PLATING SOLUTION Shipley Company LLC (US) 2003-07-16 EP disclosed
US-6197366-B1 ELECTROCONDUCTIVE METAL FILM FROM LOW TEMPERATURE BAKING FROMNITRATE SALT AND CYANO COMPOUND, CARBONYL COMPOUND OR ORGANIC SALT OF METAL AND AMINO TAKAMATSU RESEARCH LABORATORY (JP) 2001-03-06 US disclosed
EP-0989205-A1 METAL PASTE AND METHOD FOR PRODUCTION OF METAL FILM Takamatsu Research Laboratory (JP) 2000-03-29 EP disclosed
US-4283274-A Process for cracking hydrocarbons with a cracking catalyst passivated with thallium PHILLIPS PETROLEUM COMPANY (US) 1981-08-11 US disclosed
US-4238367-A Passivation of metals on cracking catalyst with thallium PHILLIPS PETROLEUM COMPANY (US) 1980-12-09 US disclosed
EP-0009819-A1 Cracking catalyst, process for cracking hydrocarbons and method for passivating contaminating metals on hydrocarbon cracking catalysts PHILLIPS PETROLEUM COMPANY (US) 1980-04-16 EP disclosed
US-4120808-A Gas discharge dielectric containing a source of boron, gallium, indium, or thallium OWENS-ILLINOIS, INC. (US) 1978-10-17 US disclosed
US-4028578-A Gas discharge dielectric containing a source of boron, gallium, indium, or thallium OWENS-ILLINOIS, INC. (US) 1977-06-07 US disclosed