⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL8718700 | 0.91 | — | — | |
| SCHEMBL8372385 | 0.91 | — | — | |
| SCHEMBL7131063 | 0.91 | — | — | |
| SCHEMBL131 | 0.89 | — | — | |
| SCHEMBL7648816 | 0.84 | — | — | |
| Hydrochloric Acid SCHEMBL9814728 | 0.80 | — | — | |
| Hydrochloric Acid SCHEMBL20838459 | 0.80 | — | — | |
| SCHEMBL5104038 | 0.80 | — | — | |
| SCHEMBL21247124 | 0.80 | — | — | |
| Methane SCHEMBL20598813 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12401340-B2 | Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation | SKYWORKS SOLUTIONS, INC. (US) | 2025-08-26 | — | — | US | claimed |
| US-20240348229-A1 | ACOUSTIC WAVE DEVICE WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE WITH HEAT DISSIPATION | SKYWORKS SOLUTIONS INC (US) | 2024-10-17 | — | — | US | claimed |
| CN-114075651-A | Tantalum-silicon dioxide sputtering target material and preparation method thereof | 宁波江丰电子材料股份有限公司 | 2022-02-22 | — | — | CN | claimed |
| CN-211222593-U | Heat-sensitive printing head heating substrate with continuous high printing performance | 山东华菱电子股份有限公司 | 2020-08-11 | — | — | CN | claimed |
| US-12401340-B2 | Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation | SKYWORKS SOLUTIONS, INC. (US) | 2025-08-26 | — | — | US | disclosed |
| US-20240348229-A1 | ACOUSTIC WAVE DEVICE WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE WITH HEAT DISSIPATION | SKYWORKS SOLUTIONS INC (US) | 2024-10-17 | — | — | US | disclosed |
| US-12047053-B2 | Surface acoustic wave resonator with multi-layer piezoelectric substrate with heat dissipation | SKYWORKS SOLUTIONS, INC. (US) | 2024-07-23 | — | — | US | disclosed |
| CN-115124330-B | Preparation method of silicon oxide ceramic target blank | 宁波江丰电子材料股份有限公司 | 2023-09-08 | — | — | CN | disclosed |
| CN-116621580-A | Tantalum silicon oxide target and preparation method thereof | 宁波江丰电子材料股份有限公司 | 2023-08-22 | — | — | CN | disclosed |
| CN-219446511-U | Heating substrate for thermal printhead with uniform printing concentration | 山东华菱电子股份有限公司 | 2023-08-01 | — | — | CN | disclosed |
| CN-115775721-A | Preparation method of laser-induced phase change graphite electrode diamond electronic device | 西安交通大学 | 2023-03-10 | — | — | CN | disclosed |
| CN-115124330-A | Preparation method of silicon oxide ceramic target blank | 宁波江丰电子材料股份有限公司 | 2022-09-30 | — | — | CN | disclosed |
| US-8102409-B2 | Printer device | SONY CORPORATION (JP) | 2012-01-24 | — | — | US | disclosed |
| EP-1839887-B1 | Printer device | SONY CORP (JP) | 2011-08-17 | — | — | EP | disclosed |
| US-7466329-B2 | Printer device | SONY CORPORATION (JP) | 2008-12-16 | — | — | US | disclosed |
| US-20070229644-A1 | Printer device | SONY CORPORATION | 2007-10-04 | — | — | US | disclosed |
| US-20070229642-A1 | Printer device | SONY CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| EP-1839887-A1 | Printer device | Sony Corporation (JP) | 2007-10-03 | — | — | EP | disclosed |
| US-6348708-B1 | Semiconductor device utilizing a rugged tungsten film | LG SEMICON CO., LTD. (KR) | 2002-02-19 | — | — | US | disclosed |
| US-5563090-A | Method for forming rugged tungsten film and method for fabricating semiconductor device utilizing the same | LG SEMICON CO., LTD. (KR) | 1996-10-08 | — | — | US | disclosed |