SCHEMBL3840571

SCHEMBL3840571

C1=C(C2=CCCCCC2)CCCCC1.C1=C(C2=CCCCCC2)CCCCC1.CC(C)O[SiH2]OC(C)C

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
PSMB5 P28074 2/20 0.33
HTR1A P08908 2/20 0.33
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
KDM5B Q9UGL1 1/20 0.31
PTGS2 P35354 1/20 0.30
TYMP P19971 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3838789 0.78 NPC1 (0.37) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL3836342 0.77 PSMB5 (0.33) PSMB5HTR1ANPC1RAB9AKDM5B
SCHEMBL3502363 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL2105114 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL3796623 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL11201526 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL3233355 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL3233362 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL21057468 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP
SCHEMBL18244171 0.76 TYMP (0.41) PSMB5NPC1RAB9APTGS2TYMP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2628744-B1 Silicon-containing surface modifier, resist underlayer film composition containing this, and patterning process SHINETSU CHEMICAL CO (JP) 2016-11-30 EP claimed
CN-114660896-B Composition for forming silicon-containing resist underlayer film, pattern forming method, and silicon compound 信越化学工业株式会社 2024-06-11 CN disclosed
CN-116804825-A Composition for forming silicon-containing metal hard mask and pattern forming method 信越化学工业株式会社 2023-09-26 CN disclosed
CN-111458980-B Composition for forming underlayer film of silicon-containing resist and method for forming pattern 信越化学工业株式会社 2023-08-11 CN disclosed
EP-2657767-B1 Patterning process SHINETSU CHEMICAL CO (JP) 2018-10-10 EP disclosed
EP-2826826-B1 COMPOSITION FOR FORMING A COATING TYPE BPSG FILM, SUBSTRATE FORMED A FILM BY SAID COMPOSITION, AND PATTERNING PROCESS USING SAID COMPOSITION SHINETSU CHEMICAL CO (JP) 2018-08-01 EP disclosed
US-9971245-B2 Silicon-containing polymer, silicon-containing compound, composition for forming a resist under layer film, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-15 US disclosed
US-20180081272-A1 THERMAL CROSSLINKING ACCELERATOR, POLYSILOXANE-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SAME, AND PATTERNING PROCESS USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-22 US disclosed
EP-2657766-B1 Patterning process SHINETSU CHEMICAL CO (JP) 2018-02-28 EP disclosed
US-9902875-B2 Composition for forming a coating type BPSG film, substrate, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-27 US disclosed
EP-2657767-A1 Patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-10-30 EP disclosed
EP-2657766-A1 Patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-10-30 EP disclosed
EP-2657240-A1 Silicon compound, silicon-containing compound, composition for forming resits underlayer film containing the same and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-10-30 EP disclosed
EP-2628744-A1 Silicon-containing surface modifier, resist underlayer film composition containing this, and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-08-21 EP disclosed
EP-2599818-A1 Silicon-containing resist underlayer film-forming composition and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-06-05 EP disclosed
EP-2599819-A1 Silicon-containing resist underlayer film-forming composition and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-06-05 EP disclosed
US-20130137271-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-05-30 US disclosed
US-20130137041-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-05-30 US disclosed
US-8198016-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-06-12 US disclosed
US-20090286188-A1 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed