Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 7/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | TP53 | P04637 | 3/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.39 |
| ▸ | THRB | P10828 | 2/20 | 0.34 |
| ▸ | ACACB | O00763 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13623220 | 0.93 | TSHR (0.39) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL13949190 | 0.93 | TSHR (0.39) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL17850002 | 0.86 | TSHR (0.39) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL16093949 | 0.85 | EPHX1 (0.41) | ALDH1A1SMN1; SMN2EPHX1THRBACACB | |
| SCHEMBL13968333 | 0.83 | TSHR (0.37) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL2132862 | 0.82 | TSHR (0.46) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL28031618 | 0.80 | GSTP1 (0.39) | EPHX1 | |
| SCHEMBL5370621 | 0.80 | EPHX1 (0.38) | TSHRALDH1A1SMN1; SMN2EPHX1ACACB | |
| SCHEMBL27778682 | 0.79 | TSHR (0.42) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL1316484 | 0.79 | TSHR (0.47) | TSHRALDH1A1TP53HIF1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 919 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120044753-A | Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board | 杭州福斯特电子材料有限公司 | 2025-05-27 | — | — | CN | claimed |
| WO-2025020810-A1 | ETCHING RESIDUE REMOVER COMPOSITION | 安集微电子科技（上海）股份有限公司 | 2025-01-30 | — | — | WO | claimed |
| US-20240368505-A1 | FLUORINE-FREE CLEANING AGENT, PREPARATION METHOD THEREFOR AND USE THEREOF | Tan Kah Kee Innovation Laboratory (CN) | 2024-11-07 | — | — | US | claimed |
| WO-2024125373-A1 | ETCHING COMPOSITION AND USE THEREOF | 宁波安集微电子科技有限公司 | 2024-06-20 | — | — | WO | claimed |
| CN-118185630-A | Etching composition and application thereof | 宁波安集微电子科技有限公司 | 2024-06-14 | — | — | CN | claimed |
| US-20240047224-A1 | RECESS ETCHING SOLUTION, RECESS ETCHING METHOD, AND SURFACE-TREATED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-02-08 | — | — | US | claimed |
| EP-4257727-A1 | RECESS ETCHING SOLUTION, RECESS ETCHING METHOD, AND SURFACE-TREATED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-11 | — | — | EP | claimed |
| US-20230295503-A1 | ETCHANT COMPOSITION AND MANUFACTURING METHOD OF DISPLAY DEVICE USING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-09-21 | — | — | US | claimed |
| CN-116770304-A | Etchant composition and method for manufacturing display device using the same | 三星显示有限公司 | 2023-09-19 | — | — | CN | claimed |
| CN-116731798-A | Fluorine-free cleaning agent, and preparation method and application thereof | 嘉庚创新实验室 | 2023-09-12 | — | — | CN | claimed |
| US-20180194949-A1 | SOL-GEL COATING COMPOSITIONS INCLUDING CORROSION INHIBITOR-ENCAPSULATED LAYERED METAL PHOSPHATES AND RELATED PROCESSES | THE BOEING COMPANY | 2018-07-12 | — | — | US | claimed |
| EP-3345975-A1 | SOL-GEL COATING COMPOSITIONS INCLUDING CORROSION INHIBITOR-ENCAPSULATED LAYERED METAL PHOSPHATES AND RELATED PROCESSES | The Boeing Company (US) | 2018-07-11 | — | — | EP | claimed |
| US-20180022937-A1 | SOL-GEL COATING COMPOSITIONS INCLUDING CORROSION INHIBITOR-ENCAPSULATED LAYERED DOUBLE HYDROXIDE AND RELATED PROCESSES | THE BOEING COMPANY | 2018-01-25 | — | — | US | claimed |
| EP-3272816-A1 | SOL-GEL COATING COMPOSITIONS INCLUDING CORROSION INHIBITOR-ENCAPSULATED LAYERED DOUBLE HYDROXIDE AND RELATED PROCESSES | The Boeing Company (US) | 2018-01-24 | — | — | EP | claimed |
| EP-2014797-A2 | Coating composition for interconnection part of electrode and plasma display panel including the same | Samsung SDI Co., Ltd. (KR) | 2009-01-14 | — | — | EP | claimed |
| US-20080303439-A1 | Coating composition for interconnection part of electrode and plasma display panel including the same | SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA (KR) | 2008-12-11 | — | — | US | claimed |
| US-6447695-B1 | WITH POLISHING RATE ADJUSTOR | JSR CORPORATION (JP) | 2002-09-10 | — | — | US | claimed |
| US-20020005017-A1 | Polishing cycles | JSR CORPORATION (JP) | 2002-01-17 | — | — | US | claimed |
| EP-1138734-A2 | Aqueous dispersion for chemical mechanical polishing of metal films | JSR Corporation (JP) | 2001-10-04 | — | — | EP | claimed |
| US-6261741-B1 | CONTAINS POLYAMIDEIMIDE RESIN, AN ORGANIC SOLVENT, ACRYLIC MONOMER OR OLIGOMER, AND PHOTOINITIATOR; MAY BE PATTERNED BY SELECTIVE ULTRAVIOLET RADIATION; USED AS PHOTO-CURING ADHESIVE OR LAYER IN HIGH-DENSITY PRINTED CIRCUIT BOARD | FUJITSU LIMITED (JP) | 2001-07-17 | — | — | US | claimed |