Methacrylic Acid

Methacrylic Acid

SCHEMBL3856792

C=C(C)C(=O)O.C=C(C)C(=O)O.CCN(C)CC

nearest known ligand 0.35

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.35
KDM5A P29375 1/20 0.33
KDM4C Q9H3R0 1/20 0.33
ALDH1A1 P00352 2/20 0.32
FFAR3 O14843 2/20 0.32
THRB P10828 1/20 0.31
CYP2C19 P33261 1/20 0.31
TSHR P16473 2/20 0.30
TGFBR1 P36897 1/20 0.30
CHRM1 P11229 2/20 0.30
CHRM2 P08172 1/20 0.30
CHRM4 P08173 1/20 0.30
CHRM5 P08912 1/20 0.30
CHRM3 P20309 1/20 0.30
LCK P06239 1/20 0.30
FYN P06241 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL420725 0.86 TDP1 (0.36) TDP1ALDH1A1FFAR3THRBTSHR
Acetic Acid SCHEMBL3412901 0.83 FFAR3 (0.47) TDP1KDM5AKDM4CALDH1A1FFAR3
SCHEMBL11762870 0.82 TDP1 (0.60) TDP1ALDH1A1THRB
Methacrylic Acid SCHEMBL1683853 0.82 CHRM1 (0.33) TDP1ALDH1A1FFAR3THRBCHRM1
Methacrylic Acid SCHEMBL1146682 0.81 CHRM2 (0.38) TDP1ALDH1A1FFAR3THRBTSHR
SCHEMBL1642046 0.80 TET2 (0.35) KDM5AKDM4CFFAR3
Methacrylic Acid SCHEMBL2581850 0.80
Methacrylic Acid SCHEMBL346724 0.80 TDP1 (0.44) TDP1ALDH1A1FFAR3THRBTSHR
Methacrylic Acid SCHEMBL129271 0.80 TDP1 (0.44) TDP1ALDH1A1FFAR3THRBTSHR
Methacrylic Acid SCHEMBL30721692 0.80 TDP1 (0.44) TDP1ALDH1A1FFAR3THRBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7579134-B2 cover layer comprises polyamic acid precursor curable to an adhesive polyimide base polymer and an ethylenically unsaturated photo-monomer; avoiding unwanted curling of a flexible printed circuit E. I. DUPONT DE NEMOURS AND COMPANY (US) 2009-08-25 US claimed
US-20060210819-A1 Polyimide composite coverlays and methods and compositions relating thereto U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2006-09-21 US claimed
US-7579134-B2 cover layer comprises polyamic acid precursor curable to an adhesive polyimide base polymer and an ethylenically unsaturated photo-monomer; avoiding unwanted curling of a flexible printed circuit E. I. DUPONT DE NEMOURS AND COMPANY (US) 2009-08-25 US disclosed
US-20060210819-A1 Polyimide composite coverlays and methods and compositions relating thereto U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2006-09-21 US disclosed
EP-1659449-A2 Low-temperature curable photosensitive compositions E.I.Du pont de nemours and company (US) 2006-05-24 EP disclosed