SCHEMBL38730

SCHEMBL38730

[Cu].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8176642 1.00
SCHEMBL8505400 1.00
SCHEMBL29453938 1.00
SCHEMBL29454702 1.00
SCHEMBL11232576 1.00
SCHEMBL311 1.00
SCHEMBL29932512 1.00
SCHEMBL29494171 1.00
SCHEMBL29357893 1.00
SCHEMBL668939 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 5368 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114899115-B Metal hot-press bonding method and application Shenzhen advanced electronic materials International Innovation Research Institute (CN) 2026-05-26 CN claimed
US-20260144151-A1 SEMICONDUCTOR PACKAGE INCLUDING TOP DIE SAMSUNG ELECTRONICS CO LTD (KR) 2026-05-21 US claimed
CN-122054718-A Neuromorphic vision sensing chip and preparation method thereof 广西华芯振邦半导体有限公司 2026-05-15 CN claimed
CN-122050931-A High-current-carrying light alloy conductor cable for ship-borne equipment and preparation method thereof 扬州亚光电缆有限公司 2026-05-15 CN claimed
US-20260123559-A1 LOW-TEMPERATURE HYBRID BONDING METHOD AND HYBRID BONDING ASSEMBLY ACCORDINGLY FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY (KR) 2026-04-30 US claimed
US-20260116044-A1 DEVICE BONDING YIELD ENG SYSTEMS INC (US) 2026-04-30 US claimed
US-12598845-B2 Solid state optoelectronic device with preformed metal support substrate MICRON TECHNOLOGY, INC. (US) 2026-04-07 US claimed
WO-2026047121-A1 PROCESS OF MANUFACTURING A COLDPLATE FOR SEMICONDUCTOR COOLING APPLICATIONS AND COLDPLATE CORINTIS SA (CH) 2026-03-05 WO claimed
US-20260061513-A1 COMPOSITE MATERIAL, ITS PREPARATION AND USE UNIV CITY HONG KONG (HK) 2026-03-05 US claimed
US-20260006887-A1 HETEROGENEOUS INTEGRATED CIRCUIT MASSACHUSETTS INST TECHNOLOGY (US) 2026-01-01 US claimed
US-4070182-A Recovery of precious metals from metal sulphides SHERRITT GORDON MINES LIMITED (CA) 1978-01-24 US claimed
US-4059568-A Method for the control of diamine catalyzed polyphenylene ether polymerization GENERAL ELECTRIC COMPANY (US) 1977-11-22 US claimed
US-4033765-A Extractions of copper from solutions by reduction with anthraquinols KENNECOTT COPPER CORPORATION (US) 1977-07-05 US claimed
US-4032332-A USING CHLORIDE, BROMIDE OR THIOCYANATE COMPOUNDS KENNECOTT COPPER CORPORATION (US) 1977-06-28 US claimed
US-4020143-A Use of raw manganese nodules for oxidation leaching of reductively roasted manganese nodules KENNECOTT COPPER CORPORATION (US) 1977-04-26 US claimed
US-4005174-A CUPROUS OXIDE BODSON FERNAND JACQUES JOSEPH 1977-01-25 US claimed
US-3988297-A Process for the preparation of polyphenylene ethers with activated copper-amine catalysts GENERAL ELECTRIC (US) 1976-10-26 US claimed
US-3983017-A Recovery of metal values from manganese deep sea nodules using ammoniacal cuprous leach solutions KENNECOTT COPPER CORPORATION (US) 1976-09-28 US claimed
US-3952045-A FROM AN ALCOHOL AND CARBON MONOXIDE, COPPER, HALIDE, ORGANO-PHOSPHORUS CATALYST ROHM GMBH (DT) 1976-04-20 US claimed
US-3943188-A Fire resistant vinyl resin with metal salt of phenolic resin STANFORD RESEARCH INSTITUTE (US) 1976-03-09 US claimed