SCHEMBL3873600

SCHEMBL3873600

CCCCCCCC(C(F)(F)F)S(=O)(=O)O

nearest known ligand 0.46

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.46
EPHX1 P07099 2/20 0.43
MAPT P10636 1/20 0.41
CES1 P23141 8/20 0.40
FAAH O00519 7/20 0.40
CES2 O00748 3/20 0.40
GPR84 Q9NQS5 2/20 0.38
FDPS P14324 1/20 0.38
MEN1 O00255 1/20 0.38
CYP1A2 P05177 1/20 0.38
KMT2A Q03164 1/20 0.38
HSD17B10 Q99714 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4759458 1.00 TP53 (0.46) TP53EPHX1MAPTCES1FAAH
SCHEMBL28887913 0.98 TP53 (0.47) TP53EPHX1MAPTCES1FAAH
SCHEMBL575574 0.93 TP53 (0.47) TP53EPHX1MAPTCES1FAAH
1,3-Propanediol SCHEMBL575643 0.93 TP53 (0.43) TP53EPHX1MAPTCES1FAAH
1,4-Butanediol SCHEMBL576085 0.93 TP53 (0.43) TP53EPHX1MAPTCES1FAAH
SCHEMBL4344566 0.92 TP53 (0.39) TP53EPHX1CES1FAAHCES2
Propylene Glycol SCHEMBL575859 0.88 TP53 (0.43) TP53EPHX1MAPTCES1GPR84
Hydroquinone SCHEMBL575698 0.87 TRPV1 (0.40) TP53MAPTMEN1KMT2AHSD17B10
SCHEMBL575945 0.87 TP53 (0.39) TP53EPHX1MAPTGPR84MEN1
1,3-Butanediol SCHEMBL575626 0.85 TP53 (0.45) TP53EPHX1CES1GPR84FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7638261-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-12-29 US disclosed
US-20090148790-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-06-11 US disclosed
US-7521169-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-04-21 US disclosed
US-20080187859-A1 Radiation-Sensitive Resin Composition JSR CORPORATION (JP) 2008-08-07 US disclosed
US-7297461-B2 Radiation sensitive resin composition JSR CORPORATION (JP) 2007-11-20 US disclosed
US-7288359-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-10-30 US disclosed
EP-1736829-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-12-27 EP disclosed
US-20060234153-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-10-19 US disclosed
US-7108955-B2 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-09-19 US disclosed
US-20050171226-A1 Radiation sensitive resin composition JSR CORPORATION (JP) 2005-08-04 US disclosed
EP-1557718-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2005-07-27 EP disclosed
US-20040143082-A1 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed
EP-1398339-A1 POLYSILOXANE, PROCESS FOR PRODUCTION THEREOF AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-03-17 EP disclosed
US-20030219680-A1 Photoresists useful for microfabrication utilizing deep ultraviolet rays such as an excimer laser, x-rays such as synchrotron radiation, and electron beams JSR CORPORATION (JP) 2003-11-27 US disclosed
US-20030170561-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-09-11 US disclosed