SCHEMBL387964

SCHEMBL387964

[Ni][Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7899847 0.58
SCHEMBL15936511 0.58
SCHEMBL6511984 0.41
SCHEMBL9845849 0.41
SCHEMBL23462142 0.00
SCHEMBL23462034 0.00
Phosphine SCHEMBL23405376 0.00
SCHEMBL23462224 0.00
Potassium Ion SCHEMBL23462233 0.00 CA4 (0.50)
SCHEMBL25432327 0.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114161025-B Brass brazing material prepared from high-nickel copper alloy waste and method thereof 华南理工大学 2023-03-24 CN claimed
CN-114161025-A Brass brazing material prepared from high-nickel copper alloy waste and method thereof 华南理工大学 2022-03-11 CN claimed
WO-2011041081-A1 INTEGRATED PROCESS FOR CONVERTING CARBOHYDRATES TO HYDROCARBONS CONOCOPHILLIPS COMPANY (US) 2011-04-07 WO claimed
CN-222205495-U Special equipment for electroplating nickel copper on inner wall of long-bent steel pipe 郑州大学 2024-12-20 CN disclosed
CN-218774974-U High-nickel copper mineral flotation machine 甘肃康兴科技有限公司 2023-03-31 CN disclosed
CN-218774974-U High-nickel copper mineral flotation machine 甘肃康兴科技有限公司 2023-03-31 CN disclosed
CN-218425096-U Mold structure for producing BB shielding cover 东莞市长讯精密技术有限公司 2023-02-03 CN disclosed
EP-3502289-B1 MANUFACTURING METHOD OF A HAIRSPRING FOR A TIMEPIECE MOVEMENT NIVAROX FAR SA (CH) 2022-11-09 EP disclosed
CN-113579257-B Multi-shaft powder feeding and spreading device for forming copper alloy multilayer composite structure and technological process thereof 烟台万隆真空冶金股份有限公司 2022-10-11 CN disclosed
CN-113523301-B Forming process of copper alloy multilayer composite structure 圣航粉末冶金河北有限公司 2022-09-23 CN disclosed
CN-111187922-B Method for selectively leaching nickel from high-nickel copper matte under normal pressure 云南锡业研究院有限公司 2022-05-06 CN disclosed
EP-2341038-A1 SELECTIVE SOLAR ABSORBENT COATING AND MANUFACTURING METHOD Abengoa Solar New Technologies, S.A. (ES) 2011-07-06 EP disclosed
US-20110121344-A1 COLOR CORRECTION FOR WAFER LEVEL WHITE LEDs CREE, INC. 2011-05-26 US disclosed
US-20110073881-A1 LEDs USING SINGLE CRYSTALLLINE PHOSPHOR AND METHODS OF FABRICATING SAME CREE, INC 2011-03-31 US disclosed
US-7915629-B2 Composite high reflectivity layer CREE, INC. (US) 2011-03-29 US disclosed
WO-2011028221-A1 HIGH REFLECTIVITY MIRROR, LIGHT EMITTING DIODE INCORPORATING THE SAME AND METHOD FOR MAKING SAME CREE, INC. (US) 2011-03-10 WO disclosed
US-20110049546-A1 HIGH REFLECTIVITY MIRRORS AND METHOD FOR MAKING SAME CREE, INC. 2011-03-03 US disclosed
US-7897419-B2 Color correction for wafer level white LEDs CREE, INC. (US) 2011-03-01 US disclosed
EP-2283526-A2 EMISSION TUNING METHODS AND DEVICES FABRICATED UTILIZING METHODS Cree, Inc. (US) 2011-02-16 EP disclosed
EP-2277206-A1 LEDs USING SINGLE CRYSTALLINE PHOSPHOR AND METHODS OF FABRICATING SAME Cree, Inc. (US) 2011-01-26 EP disclosed