Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MMP1 | P03956 | 1/20 | 0.35 |
| ▸ | MMP2 | P08253 | 1/20 | 0.35 |
| ▸ | MMP3 | P08254 | 1/20 | 0.35 |
| ▸ | MMP9 | P14780 | 1/20 | 0.35 |
| ▸ | MMP13 | P45452 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3883597 | 0.83 | — | — | |
| SCHEMBL17474777 | 0.83 | MEN1 (0.39) | MMP1MMP2MMP3MMP9MMP13 | |
| SCHEMBL17474778 | 0.83 | MEN1 (0.39) | MMP1MMP2MMP3MMP9MMP13 | |
| SCHEMBL7119132 | 0.82 | TSHR (0.31) | — | |
| SCHEMBL8274815 | 0.81 | CYP2D6 (0.45) | MMP1MMP2MMP3MMP9MMP13 | |
| SCHEMBL8274820 | 0.81 | CYP2D6 (0.45) | MMP1MMP2MMP3MMP9MMP13 | |
| SCHEMBL16031250 | 0.81 | CYP2D6 (0.45) | MMP1MMP2MMP3MMP9MMP13 | |
| SCHEMBL1941442 | 0.77 | TDP1 (0.43) | — | |
| SCHEMBL1941444 | 0.77 | TDP1 (0.43) | — | |
| SCHEMBL8853350 | 0.77 | TDP1 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3248224-B1 | ELECTRONIC DEVICE MODULE | YPAREX B V (NL) | 2020-12-23 | — | — | EP | claimed |
| US-20170373209-A1 | ELECTRONIC DEVICE MODULE | YPAREX B.V. (NL) | 2017-12-28 | — | — | US | claimed |
| EP-1157052-B1 | METHOD OF PREPARING FUNCTIONALIZED POLYPHENYLENE ETHERS | KOMETRA KUNSTSTOFF MODIFIKATOREN & ADDITIV (DE) | 2003-11-05 | — | — | EP | claimed |
| US-10903381-B2 | Electronic device module | YPAREX B.V. (NL) | 2021-01-26 | — | — | US | disclosed |
| EP-3248224-B1 | ELECTRONIC DEVICE MODULE | YPAREX B V (NL) | 2020-12-23 | — | — | EP | disclosed |
| US-20170373209-A1 | ELECTRONIC DEVICE MODULE | YPAREX B.V. (NL) | 2017-12-28 | — | — | US | disclosed |
| EP-3248224-A1 | ELECTRONIC DEVICE MODULE | Yparex B.V. (NL) | 2017-11-29 | — | — | EP | disclosed |
| EP-3048649-A1 | Electronic device module | Yparex B.V. (NL) | 2016-07-27 | — | — | EP | disclosed |
| EP-1152014-B1 | RESIN COMPOSITION | MITSUBISHI RAYON CO (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-6552130-B1 | Used as a covering material for civil engineering and construction applications | MITSUBISHI RAYON CO., LTD. (JP) | 2003-04-22 | — | — | US | disclosed |
| EP-1152014-A1 | RESIN COMPOSITION | Mitsubishi Rayon Co., Ltd. (JP) | 2001-11-07 | — | — | EP | disclosed |