SCHEMBL388724

SCHEMBL388724

[GeH2-].[GeH2-].[Ni+2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3927799 0.71 KDM3A (1.00)
SCHEMBL29742292 0.71
SCHEMBL29362740 0.71
SCHEMBL9297420 0.71
Hydrochloric Acid SCHEMBL8845531 0.50
SCHEMBL5877920 0.50
Water SCHEMBL2721099 0.50
SCHEMBL1468246 0.50
SCHEMBL4817090 0.50
SCHEMBL9450927 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 718 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114256444-B Phosphorus-nickel-germanium composite anode material, preparation method and application thereof 公元股份有限公司 2024-11-15 CN claimed
EP-3320562-B1 FORMULATIONS TO SELECTIVELY ETCH SILICON GERMANIUM RELATIVE TO GERMANIUM ENTEGRIS INC (US) 2024-08-28 EP claimed
US-11777016-B2 Method of forming backside power rails TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-03 US claimed
CN-109841498-B Semiconductor device and method for manufacturing the same 爱思开海力士有限公司 2023-09-19 CN claimed
CN-116031265-B Photodetector integrated with solar cell and CMOS circuit and manufacturing method 上海铭锟半导体有限公司 2023-09-15 CN claimed
CN-116031265-A Photodetector integrated with solar cell and CMOS circuit and manufacturing method 上海铭锟半导体有限公司 2023-04-28 CN claimed
US-20220336641-A1 Method of Forming Backside Power Rails TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2022-10-20 US claimed
CN-114256444-A Phosphorus-nickel-germanium composite negative electrode material, and preparation method and application thereof 永高股份有限公司 2022-03-29 CN claimed
CN-107851660-B Formulations for selective etching of silicon germanium relative to germanium 恩特格里斯公司 2022-02-01 CN claimed
US-11094778-B2 Capacitor with high work function interface layer SK Hynix Inc. (KR) 2021-08-17 US claimed
US-7880228-B2 Semiconductor device including MISFET KABUSHIKI KAISHA TOSHIBA (JP) 2011-02-01 US claimed
US-20100244154-A1 SEMICONDUCTOR DEVICE INCLUDING MISFET KABUSHIKI KAISHA TOSHIBA 2010-09-30 US claimed
US-20100190328-A1 Self Aligned Silicided Contacts HAMPP ROLAND 2010-07-29 US claimed
US-20090218640-A1 Self Aligned Silicided Contacts INFINEON TECHNOLOGIES AG (DE) 2009-09-03 US claimed
US-20090206370-A1 METHOD AND APPARATUS FOR FABRICATING A HETEROJUNCTION BIPOLAR TRANSISTOR GLOBALFOUNDRIES U.S. INC. 2009-08-20 US claimed
US-20090050972-A1 Strained Semiconductor Device and Method of Making Same CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. (SG) 2009-02-26 US claimed
US-20070187767-A1 SEMICONDUCTOR DEVICE INCLUDING MISFET KABUSHIKI KAISHA TOSHIBA 2007-08-16 US claimed
US-20040178476-A1 Etching metal using sonication BRASK JUSTIN K (US) 2004-09-16 US claimed
US-6746967-B2 Etching metal using sonication INTEL CORPORATION 2004-06-08 US claimed
US-20040061199-A1 Etching metal using sonication INTEL CORPORATION 2004-04-01 US claimed