SCHEMBL3887631

SCHEMBL3887631

BB.[KH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL539 0.82
Ammonia Solution, Strong SCHEMBL11594289 0.67
SCHEMBL723481 0.67
SCHEMBL948684 0.67
SCHEMBL1396185 0.67
SCHEMBL23040651 0.67
SCHEMBL4386720 0.67
SCHEMBL7367290 0.67
Helium SCHEMBL7035046 0.67
Fluoride SCHEMBL21955713 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7572303-B2 A symmetrical dialkyl carbonate, a metal, borong, silicon, or group 7 compound, a hydrogen or hydrocarbon-based fuel, an oxidizer, and a metallic cocatalyst; minimized hydrolysis; improved combustion and storage stability OCTANE INTERNATIONAL, LTD. (US) 2009-08-11 US disclosed
EP-0954558-B1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 2006-06-14 EP disclosed
US-20050044778-A1 Fuel compositions employing catalyst combustion structure OCTANE INTERNATIONAL, LTD. 2005-03-03 US disclosed
US-20040237384-A1 Fuel compositions exhibiting improved fuel stability OCTANE INTERNATIONAL, LTD. 2004-12-02 US disclosed
US-6660154-B2 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound SHIPLEY COMPANY, L.L.C. 2003-12-09 US disclosed
US-6652608-B1 Fuel compositions exhibiting improved fuel stability OCTANE INTERNATIONAL, LTD. 2003-11-25 US disclosed
EP-1201790-B1 Seed layer SHIPLEY CO LLC (US) 2003-05-02 EP disclosed
US-20020084193-A1 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound SHIPLEY COMPANY, L.L.C. 2002-07-04 US disclosed
EP-1201790-A1 Seed layer Shipley Company LLC (US) 2002-05-02 EP disclosed
EP-1051461-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR, William C. (US) 2000-11-15 EP disclosed
WO-1999066009-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR WILLIAM C (US) 1999-12-23 WO disclosed
EP-0954558-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR, William C. (US) 1999-11-10 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed
US-4214183-A DIELECTRIC CHARGE STORAGE LAYER CONTAINING RUBIDIUM OXIDE OR FRANCIUM OXIDE OWENS-ILLINOIS, INC. (US) 1980-07-22 US disclosed
US-4121133-A Dielectric for multiple gaseous discharge display/memory panel having improved voltage characteristics OWENS-ILLINOIS, INC. (US) 1978-10-17 US disclosed
US-4114064-A MULTIPLE GASEOUS DISCHARGE DISPLAY/MEMORY PANEL HAVING IMPROVED VOLTAGE CHARACTERISTICS OWENS-ILLINOIS, INC. (US) 1978-09-12 US disclosed
US-3958048-A Aqueous suspensions for surface activation of nonconductors for electroless plating CROWN CITY PLATING COMPANY (US) 1976-05-18 US disclosed
US-3932920-A MEMORY PANEL HAVING IMPROVED VOLTAGE CHARACTERISTICS OWENS-ILLINOIS, INC. (US) 1976-01-20 US disclosed