SCHEMBL3906642

SCHEMBL3906642

CCCCCCCCCCCCOc1cc(C(=O)O)c(OCCCCCCCCCCCC)cc1C(=O)O

nearest known ligand 0.64

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
PTPN11 Q06124 7/20 0.64
S1PR3 Q99500 1/20 0.64
PTPN1 P18031 1/20 0.59
PTPN6 P29350 1/20 0.59
PLA2G2A P14555 1/20 0.57
TP53 P04637 1/20 0.57
TSHR P16473 1/20 0.57
PLA2G4B P0C869 1/20 0.56
ALDH1A1 P00352 1/20 0.54
HPGD P15428 1/20 0.54
RARB P10826 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10539639 1.00 PTPN11 (0.64) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL4462194 1.00 PTPN11 (0.64) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL35210991 1.00 PTPN11 (0.64) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL668981 1.00 PTPN11 (0.64) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL8679152 1.00 PTPN11 (0.64) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL8167721 0.98 PTPN11 (0.61) PTPN11S1PR3PTPN1PTPN6PLA2G2A
Hydrochloric Acid SCHEMBL8154036 0.96 PTPN11 (0.60) PTPN11S1PR3PTPN1PTPN6PLA2G2A
Hydrochloric Acid SCHEMBL9038246 0.96 PTPN11 (0.60) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL16836639 0.93 PTPN11 (0.60) PTPN11S1PR3PTPN1PTPN6PLA2G2A
SCHEMBL29419922 0.89 PTPN11 (0.54) PTPN11S1PR3PTPN1PTPN6PLA2G2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7695645-B2 Conductive polymers having highly enhanced solubility in organic solvent and electrical conductivity and synthesizing process thereof LEE SUCK-HYUN 2010-04-13 US disclosed
US-7550522-B2 Composition of liquid thermoset resin and gelator HEXCEL COMPOSITES LTD (GB) 2009-06-23 US disclosed
EP-1603962-B1 IMPROVEMENTS IN OR RELATING TO THERMOSETTING RESIN COMPOSITIONS HEXCEL COMPOSITES LTD (GB) 2009-02-04 EP disclosed
US-20080308771-A1 AREA LICONDUCTIVE POLYMERS HAVING HIGHLY ENHANCED SOLUBILITY IN ORGANIC SOLVENT AND ELECTRICAL CONDUCTIVITY AND SYNTHESIZING PROCESS THEREOFGHT LEE SUCK-HYUN 2008-12-18 US disclosed
US-20070142600-A1 Thermosetting resin compositions HEXCEL COMPOSITES LIMITED (GB) 2007-06-21 US disclosed
EP-0813563-A1 HYDROLYSIS-RESISTANT ARAMIDS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1997-12-29 EP disclosed
WO-1996028494-A1 HYDROLYSIS-RESISTANT ARAMIDS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1996-09-19 WO disclosed
US-5543492-A ALKOXY SUBSTITUTION ON AROMATIC MONOMER UNITS; HYDROLYTIC STABILITY, HIGH TEMPERATURE RESISTANCE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1996-08-06 US disclosed