SCHEMBL3909647

SCHEMBL3909647

CCCCc1c(O)ccc(Cc2ccc(O)c(CCCC)c2C)c1C

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYR P14679 3/20 0.51
HTT P42858 3/20 0.46
HPGD P15428 3/20 0.46
NPC1 O15118 1/20 0.46
MAPK1 P28482 1/20 0.46
RAB9A P51151 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
MAPT P10636 2/20 0.41
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
ALOX5 P09917 1/20 0.41
ALOX15 P16050 1/20 0.41
TSHR P16473 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
KDM4E B2RXH2 3/20 0.40
ALDH1A1 P00352 3/20 0.40
GLA P06280 2/20 0.40
GAA P10253 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL224102 0.94 TYR (0.59) TYRHTTHPGDNPC1MAPK1
SCHEMBL10644329 0.90 TYR (0.44) TYRHTTHPGDNPC1MAPK1
SCHEMBL709628 0.90 TYR (0.58) TYRHTTHPGDNPC1MAPK1
SCHEMBL28635846 0.89 TYR (0.51) TYRHTTHPGDNPC1MAPK1
SCHEMBL25276443 0.86 TYR (0.49) TYRHTTHPGDNPC1MAPK1
SCHEMBL7950540 0.84 TYR (0.53) TYRHTTHPGDNPC1MAPK1
SCHEMBL28956867 0.83 TYR (0.69) TYRHTTMEN1KMT2AMAPT
SCHEMBL28796605 0.83 TYR (0.54) TYRHTTHPGDNPC1MAPK1
SCHEMBL21307644 0.82 ESR1 (0.42) TYRHTTHPGDMEN1KMT2A
SCHEMBL710654 0.81 HPGD (0.58) TYRHTTHPGDNPC1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7521016-B2 Pressurized gas introducing device, and injection molding method for moldings having hollow portion MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-04-21 US disclosed
US-20050226954-A1 Pressurized gas introducing device, and injection molding method for moldings having hollow portion MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2005-10-13 US disclosed