SCHEMBL391827

SCHEMBL391827

CCN(O)CCNO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8838853 0.97
Acetic Acid SCHEMBL1982443 0.89 PAOX (0.31)
Acetic Acid SCHEMBL2682622 0.89 PAOX (0.31)
SCHEMBL16872851 0.85
SCHEMBL16740586 0.85
SCHEMBL16740581 0.85
SCHEMBL7943213 0.81
SCHEMBL14724352 0.78
SCHEMBL27806668 0.77 CA12 (0.32)
SCHEMBL9393025 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 349 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119639431-A Fatty acid amide cutting agent for Antarctic drilling as well as preparation method and application thereof 中国石油大学(华东) 2025-03-18 CN claimed
CN-118792021-A High-temperature-resistant emulsifier for oil-based drilling fluid and preparation method thereof 北京石大博诚科技有限公司 2024-10-18 CN claimed
CN-114045046-B Red reactive dye for printing with low urea dependency and preparation method thereof 江苏德美科化工有限公司 2024-03-12 CN claimed
CN-114213869-B Multi-active-group monoazo yellow reactive dye and preparation method thereof 江苏德美科化工有限公司 2023-12-26 CN claimed
US-11377624-B2 Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process BASF SE (DE) 2022-07-05 US claimed
CN-114213869-A Multi-active-group monoazo yellow reactive dye and preparation method thereof 江苏德美科化工有限公司 2022-03-22 CN claimed
CN-114045046-A Red reactive dye for low-urea-dependence printing and preparation method thereof 江苏德美科化工有限公司 2022-02-15 CN claimed
US-20210301221-A1 CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS BASF SE (DE) 2021-09-30 US claimed
EP-3059004-B1 METHOD FOR REMOVING SOX FROM GAS WITH COMPLEX ALCOHOL-AMINE SOLUTION BEIJING BOYUAN HENGSHENG HIGH TECH CO LTD (CN) 2021-06-30 EP claimed
EP-3720938-A1 CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS BASF SE (DE) 2020-10-14 EP claimed
CN-102343547-A Thermochemistry mechanical polishing method of sapphire substrate material and polishing solution UNIV TIANJIN TECHNOLOGY 2012-02-08 CN claimed
US-8003587-B2 Semiconductor process residue removal composition and process EKC TECHNOLOGY, INC. (US) 2011-08-23 US claimed
EP-2222421-A1 PRINTER HEAD AND PRINTER DISK CLEANING COMPOSITIONS AND METHODS OF USE EKC TECHNOLOGY, INC. (US) 2010-09-01 EP claimed
US-20090203566-A1 Semi Conductor Process Residue Removal Composition and Process EKC TECHNOLOGY, INC. 2009-08-13 US claimed
WO-2009070190-A1 PRINTER HEAD AND PRINTER DISK CLEANING COMPOSITIONS AND METHODS OF USE EKC TECHNOLOGY, INC. (US) 2009-06-04 WO claimed
US-20090137439-A1 Printer Head and Printer Disk Cleaning Compositions and Methods of Use EKC TECHNOLOGY, INC. 2009-05-28 US claimed
CN-100425385-C Leadless solder paste and its preparation method DARBOND TECHNOLOGY CO LTD (CN) 2008-10-15 CN claimed
CN-1951621-A Leadless solder paste and its preparation method DARBOND TECHNOLOGY CO LTD YANT (CN) 2007-04-25 CN claimed
US-20050107467-A1 Methods for producing and using a Cu(I)-based wood preservative OSMOSE, INC 2005-05-19 US claimed
WO-2005037507-A1 METHODS FOR PRODUCING AND USING A CU(1)-BASED WOOD PRESERVATIVE PHIBRO-TECH, INC. (US) 2005-04-28 WO claimed