⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28073860 | 0.89 | — | — | |
| SCHEMBL85457 | 0.87 | — | — | |
| SCHEMBL27861426 | 0.82 | — | — | |
| SCHEMBL28221907 | 0.82 | — | — | |
| SCHEMBL29269184 | 0.82 | — | — | |
| SCHEMBL7795632 | 0.75 | — | — | |
| SCHEMBL8971061 | 0.75 | — | — | |
| Hydrogen Sulfide SCHEMBL9164199 | 0.75 | — | — | |
| SCHEMBL9505413 | 0.75 | — | — | |
| SCHEMBL6731352 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114774722-A | Preparation method of hot-dip reinforced aluminum alloy material | 江苏嘉盈装饰新材料有限公司 | 2022-07-22 | — | — | CN | claimed |
| CN-113957280-B | High-strength high-plasticity high-rigidity aluminum-based composite material and preparation method thereof | 南京理工大学 | 2022-06-28 | — | — | CN | claimed |
| CN-113957280-A | High-strength high-rigidity aluminum-based composite material and preparation method thereof | 南京理工大学 | 2022-01-21 | — | — | CN | claimed |
| CN-109678517-B | In-situ AlN-B4C-reinforced silicon carbide honeycomb ceramic and preparation method thereof | 武汉科技大学 | 2021-09-28 | — | — | CN | claimed |
| CN-110951979-B | Preparation method of high-strength high-heat-conductivity die-casting aluminum alloy material and die-casting aluminum alloy material | 广州致远新材料科技有限公司 | 2021-06-29 | — | — | CN | claimed |
| CN-110983119-B | High-strength high-thermal-conductivity die-casting aluminum alloy material and preparation method thereof | 广州致远新材料科技有限公司 | 2021-06-29 | — | — | CN | claimed |
| CN-108975925-B | Preparation method of ladle refractory air brick | 山东银山耐火材料有限公司 | 2021-02-02 | — | — | CN | claimed |
| CN-110983215-A | Heat treatment method of high-strength high-heat-conductivity die-casting aluminum alloy material | 广州致远新材料科技有限公司 | 2020-04-10 | — | — | CN | claimed |
| CN-110983119-A | High-strength high-thermal-conductivity die-casting aluminum alloy material and preparation method thereof | 广州致远新材料科技有限公司 | 2020-04-10 | — | — | CN | claimed |
| CN-110951979-A | Preparation method of high-strength high-heat-conductivity die-casting aluminum alloy material and die-casting aluminum alloy material | 广州致远新材料科技有限公司 | 2020-04-03 | — | — | CN | claimed |
| US-8186565-B1 | Method of bonding aluminum-boron-carbon composites | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-05-29 | — | — | US | claimed |
| CN-101528407-B | Improved method for bonding aluminum-boron-carbon composites | DOW GLOBAL TECHNOLOGIES INC | 2012-01-04 | — | — | CN | claimed |
| CN-101528407-A | Improved method for bonding aluminum-boron-carbon composites | DOW GLOBAL TECHNOLOGIES INC (US) | 2009-09-09 | — | — | CN | claimed |
| EP-2073951-A2 | IMPROVED METHOD OF BONDING ALUMINUM-BORON-CARBON COMPOSITES | Dow Global Technologies Inc. (US) | 2009-07-01 | — | — | EP | claimed |
| WO-2008048999-A2 | IMPROVED METHOD OF BONDING ALUMINUM-BORON-CARBON COMPOSITES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-04-24 | — | — | WO | claimed |
| EP-0807189-B1 | HARD DISK DRIVE COMPONENTS AND METHODS OF MAKING SAME | DOW CHEMICAL CO (US) | 2000-09-27 | — | — | EP | claimed |
| EP-0799325-B1 | Computer hard disk and process for making same | DOW CHEMICAL CO (US) | 2000-05-10 | — | — | EP | claimed |
| US-6042627-A | Aluminum-boron-carbon abrasive article and method to form said article | THE DOW CHEMICAL COMPANY (US) | 2000-03-28 | — | — | US | claimed |
| US-5820965-A | Computer disk substrate, the process for making same, and the material made thereof | THE DOW CHEMICAL COMPANY (US) | 1998-10-13 | — | — | US | claimed |
| US-5780164-A | Computer disk substrate, the process for making same, and the material made therefrom | THE DOW CHEMICAL COMPANY (US) | 1998-07-14 | — | — | US | claimed |