⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL728502 | 0.95 | — | — | |
| SCHEMBL31282291 | 0.60 | — | — | |
| SCHEMBL217612 | 0.60 | — | — | |
| SCHEMBL1446120 | 0.60 | — | — | |
| SCHEMBL15774 | 0.60 | — | — | |
| SCHEMBL7240952 | 0.59 | — | — | |
| SCHEMBL10940023 | 0.59 | — | — | |
| SCHEMBL28095 | 0.59 | — | — | |
| SCHEMBL45125 | 0.59 | — | — | |
| SCHEMBL1296 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3514822-B1 | METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE | TORAY INDUSTRIES (JP) | 2023-04-26 | — | — | EP | disclosed |
| US-7535106-B2 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | RENESAS TECHNOLOGY CORP. (JP) | 2009-05-19 | — | — | US | disclosed |
| US-20070114653-A1 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | HITACHI, LTD. (JP) | 2007-05-24 | — | — | US | disclosed |
| US-7183650-B2 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | RENESAS TECHNOLOGY CORP. (JP) | 2007-02-27 | — | — | US | disclosed |
| US-20040217455-A1 | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor | RENESAS TECHNOLOGY CORP. (JP) | 2004-11-04 | — | — | US | disclosed |
| US-4615919-A | POSITIONING LIQUID CRYSTALS BETWEEN BASE PLATES COATED WITH NYLON, EPOXY RESIN, AND TANTALUM AND INDIUM COMPOUNDS | CANON KABUSHIKI KAISHA (JP) | 1986-10-07 | — | — | US | disclosed |