Fluoride

Fluoride

SCHEMBL3973518

C=CC[SiH3].F

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride SCHEMBL15013581 1.00
SCHEMBL65419 0.95
SCHEMBL27627000 0.95
SCHEMBL11237794 0.90
Ammonia Solution, Strong SCHEMBL9578676 0.90
SCHEMBL29199297 0.90
Bromide SCHEMBL2123205 0.90
Hydrochloric Acid SCHEMBL2127643 0.90
Ethylene SCHEMBL9078281 0.90
Charcoal, Activated SCHEMBL4542567 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1948742-A2 PROCESS FOR THE PREPARATION OF COATINGS WITH SPECIFIC SURFACE PROPERTIES E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-07-30 EP claimed
WO-2007059133-A2 PROCESS FOR THE PREPARATION OF COATINGS WITH SPECIFIC SURFACE PROPERTIES E.I. DU PONT DE NEMOURS AND COMPANY (US) 2007-05-24 WO claimed
US-20070111007-A1 Process for the preparation of coatings with specific surface properties E. I. DU PONT DE NEMOURS AND COMPANY 2007-05-17 US claimed
EP-2790828-B1 PREPARATION OF AN OLEFIN OLIGOMERIZATION CATALYST CHEVRON PHILLIPS CHEMICAL CO LP (US) 2018-09-19 EP disclosed
CN-108463491-A Fluorine-containing envelope and hydrophobic oleophobic application composition 住友化学株式会社 2018-08-28 CN disclosed
US-9956548-B2 Preparation of an olefin oligomerization catalyst CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) 2018-05-01 US disclosed
CN-206033639-U Fluorine alkyl silane's apparatus for producing 衢州氟硅技术研究院 2017-03-22 CN disclosed
CN-103155146-B For manufacturing the method for chip stack and for performing the carrier of the method EV 集团 E·索尔纳有限责任公司 2016-06-08 CN disclosed
US-20140343221-A1 POWDER COATING COMPOSITION AXALTA COATNG SYSTEMS IP CO., LLC (US) 2014-11-20 US disclosed
WO-2014099580-A1 POWDER COATING COMPOSITION Axalta Coating Systems IP Co. LLC (US) 2014-06-26 WO disclosed
WO-2014099579-A1 PROCESS FOR THE PREPARATION OF A POWDER COATING COMPOSITION Axalta Coating Systems IP Co. LLC (US) 2014-06-26 WO disclosed
CN-1292462-C Multilayer circuit board, method of manufacturing the same, electronic device, and electronic apparatus SEIKO EPSON CORP (JP) 2006-12-27 CN disclosed
US-20060262410-A1 METHOD OF MANUFACTURING MICROLENS, MICROLENS, OPTICAL FILM, SCREEN FOR PROJECTION, PROJECTOR SYSTEM, ELECTROOPTICAL DEVICE AND ELECTRONIC EQUIPMENT SEIKO EPSON CORPORATION (JP) 2006-11-23 US disclosed
US-20060214088-A1 Method for manufacturing photoelectric transducer, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2006-09-28 US disclosed
EP-1341278-B1 Surface-emitting semiconductor light-emitting device and method of manufacturing the same, optical module, and light-transmission device SEIKO EPSON CORP (JP) 2006-04-26 EP disclosed
CN-1503338-A Multilayer circuit board, method of manufacturing the same, electronic device, and electronic apparatus ������������ʽ���� 2004-06-09 CN disclosed
US-20040000429-A1 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2004-01-01 US disclosed
US-20030197184-A1 Surface-emitting light-emitting device and method of manufacturing the same, optical module, and light-transmission device SEIKO EPSON CORPORATION (JP) 2003-10-23 US disclosed
EP-1355522-A2 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2003-10-22 EP disclosed
EP-1341278-A1 Surface-emitting semiconductor light-emitting device and method of manufacturing the same, optical module, and light-transmission device SEIKO EPSON CORPORATION (JP) 2003-09-03 EP disclosed