SCHEMBL3989870

SCHEMBL3989870

COC(C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28399324 0.79
SCHEMBL27626219 0.76
SCHEMBL3985911 0.74
SCHEMBL5029933 0.70
SCHEMBL39994 0.70
SCHEMBL4634539 0.70
SCHEMBL28095 0.67
Iodide SCHEMBL19458794 0.67
SCHEMBL21980762 0.67
SCHEMBL28993315 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118632884-A Based on non-brittle coating to improve glass strength and fracture toughness 艾瑟巨公司 2024-09-10 CN claimed
CN-118632884-A Based on non-brittle coating to improve glass strength and fracture toughness 艾瑟巨公司 2024-09-10 CN disclosed
CN-116885279-A Lithium ion battery electrolyte additive, electrolyte and application 衢州科峰新材料有限公司 2023-10-13 CN disclosed
CN-115715276-A Glass strength and fracture toughness improvement based on non-brittle wear-resistant coatings 艾瑟巨公司 2023-02-24 CN disclosed
CN-112724925-B Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2022-08-02 CN disclosed
CN-112724925-A Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2021-04-30 CN disclosed
CN-101322074-B Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film NISSAN CHEMICAL IND LTD 2013-01-23 CN disclosed
US-20120276483-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-01 US disclosed
US-20090326151-A1 HAIR COSMETIC KONISHI CO., LTD. (JP) 2009-12-31 US disclosed
EP-2039347-A1 COSMETIC HAIR PREPARATION Shiseido Company, Limited (JP) 2009-03-25 EP disclosed
CN-101322074-A Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film NISSAN CHEMICAL IND LTD (JP) 2008-12-10 CN disclosed