SCHEMBL4006983

SCHEMBL4006983

C=CC(F)OB(OC(F)C=C)OC(F)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1887209 0.77
SCHEMBL2641144 0.75
SCHEMBL370740 0.69
SCHEMBL465415 0.69
Ethylene SCHEMBL20139205 0.67
SCHEMBL14357909 0.67
SCHEMBL8469927 0.65
SCHEMBL2780212 0.65
SCHEMBL278123 0.65
SCHEMBL4407798 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1773848-B1 SALTS CONTAINING ALKOXYTRIS (FLUOROALKYL) BORATE ANIONS MERCK PATENT GMBH (DE) 2009-12-30 EP claimed
EP-3216837-B1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO LTD (JP) 2020-07-15 EP disclosed
US-20180294242-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2018-10-11 US disclosed
US-20180026003-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2018-01-25 US disclosed
EP-3216837-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM Furukawa Electric Co. Ltd. (JP) 2017-09-13 EP disclosed