SCHEMBL4015579

SCHEMBL4015579

CCCCCCOOC(=O)c1cccc(C)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.46
NPC1 O15118 1/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
RAB9A P51151 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
SMPD1 P17405 3/20 0.46
LMNA P02545 2/20 0.44
HDAC3 O15379 1/20 0.44
HDAC4 P56524 1/20 0.44
HDAC1 Q13547 1/20 0.44
HDAC7 Q8WUI4 1/20 0.44
HDAC2 Q92769 1/20 0.44
HDAC10 Q969S8 1/20 0.44
HDAC11 Q96DB2 1/20 0.44
HDAC8 Q9BY41 1/20 0.44
HDAC6 Q9UBN7 1/20 0.44
HDAC9 Q9UKV0 1/20 0.44
HDAC5 Q9UQL6 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7625235 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7632847 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7625821 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7633324 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7631542 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7626182 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7628661 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7630658 0.87 HDAC8 (0.43) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL7623869 0.86 PARP1 (0.42) HPGDNPC1CYP1A2CYP2C9CYP2C19
SCHEMBL6057350 0.85 ESR1 (0.60) HPGDNPC1CYP1A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105717747-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
CN-105717743-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
CN-116802243-A Film-like adhesive and method for producing connection structure 株式会社力森诺科 2023-09-22 CN disclosed
CN-111511868-B Sustained-release complexing agent comprising interlayer-modified layered inorganic compound and method for producing same 东亚合成株式会社 2023-07-28 CN disclosed
CN-111356652-B Interlayer crosslinked layered inorganic compound and method for producing same 东亚合成株式会社 2023-07-07 CN disclosed
CN-113557273-B Adhesive film for circuit connection, method for producing same, method for producing circuit connection structure, and adhesive film housing set 株式会社力森诺科 2023-06-16 CN disclosed
CN-111662414-B Rubbery polymer, graft copolymer and thermoplastic resin composition 大科能宇菱通株式会社 2023-04-25 CN disclosed
CN-112480682-B Addition-curable silicone composition, cured product thereof, sheet, and optical element 信越化学工业株式会社 2023-02-17 CN disclosed
CN-115667395-A Thermoplastic resin composition and molded article thereof 大科能宇菱通株式会社 2023-01-31 CN disclosed
CN-110997804-B Thermoplastic resin composition and molded article produced therefrom 乐天尖端材料株式会社 2023-01-24 CN disclosed
CN-111995975-B Adhesive composition and structure 日立化成株式会社 2022-12-02 CN disclosed
US-6835889-B2 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2004-12-28 US disclosed
US-20040256757-A1 Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads JSP CORPORATION (JP) 2004-12-23 US disclosed
EP-1485241-A1 COMPOSITE FOAMED POLYPROPYLENE RESIN MOLDING AND METHOD OF PRODUCING SAME JSP Corporation (JP) 2004-12-15 EP disclosed
US-20040191659-A1 Toner CANON KABUSHIKI KAISHA (JP) 2004-09-30 US disclosed
EP-1426829-A2 Toner CANON KABUSHIKI KAISHA (JP) 2004-06-09 EP disclosed
WO-2003078127-A1 COMPOSITE FOAMED POLYPROPYLENE RESIN MOLDING AND METHOD OF PRODUCING SAME JSP CORPORATION (JP) 2003-09-25 WO disclosed
US-20030107465-A1 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2003-06-12 US disclosed
WO-2002024794-A9 EXPANDED POLYPROPYLENE RESIN BEAD JSP CORP (JP) 2002-05-10 WO disclosed
US-6136751-A LOW MOLECULAR WEIGHT ORGANIC MATERIAL DISPERSED IN CARBAMATE-CONTAINING ACRYLIC GRAFT POLYMER MATRIX RESIN RICOH COMPANY, LTD. (JP) 2000-10-24 US disclosed