Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.54 |
| ▸ | KDM4E | B2RXH2 | 9/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.51 |
| ▸ | GAA | P10253 | 8/20 | 0.51 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.51 |
| ▸ | MAPT | P10636 | 3/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | PTPN22 | Q9Y2R2 | 1/20 | 0.48 |
| ▸ | GLA | P06280 | 3/20 | 0.46 |
| ▸ | HPGD | P15428 | 1/20 | 0.46 |
| ▸ | HTT | P42858 | 1/20 | 0.46 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.46 |
| ▸ | POLB | P06746 | 2/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13478402 | 0.91 | KDM4E (0.58) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL13060238 | 0.91 | KDM4E (0.58) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL9423739 | 0.91 | MEN1 (0.47) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL9423428 | 0.86 | MEN1 (0.55) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL21686486 | 0.84 | KMT2A (0.50) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL22202388 | 0.84 | MEN1 (0.49) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL11222127 | 0.84 | KMT2A (0.50) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL8402796 | 0.82 | KMT2A (0.51) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL5596941 | 0.81 | HSD17B10 (0.48) | MEN1KMT2AKDM4EALDH1A1GAA | |
| SCHEMBL9423775 | 0.80 | KDM4E (0.45) | MEN1KMT2AKDM4EGAANPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5302672-A | Heat resistance | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1994-04-12 | — | — | US | claimed |
| US-20250320180-A1 | HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT | DIC CORPORATION (JP) | 2025-10-16 | — | — | US | disclosed |
| US-20250277081-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE | DIC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| US-20250277080-A1 | PHENOLIC HYDROXY GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | DIC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| US-20250223396-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | DIC CORPORATION (JP) | 2025-07-10 | — | — | US | disclosed |
| WO-2025105121-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLABLE ADHESIVE MATERIAL | DIC株式会社 | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105119-A1 | EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD | DIC株式会社 | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105118-A1 | EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD | DIC株式会社 | 2025-05-22 | — | — | WO | disclosed |
| EP-4261037-B1 | EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2025-04-16 | — | — | EP | disclosed |
| EP-4527834-A1 | GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE | DIC Corporation (JP) | 2025-03-26 | — | — | EP | disclosed |
| US-20060235183-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-10-19 | — | — | US | disclosed |
| US-7087702-B2 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2006-08-08 | — | — | US | disclosed |
| EP-1411101-B1 | Epoxy resin composition and process for producing epoxy resins | DAINIPPON INK & CHEMICALS (JP) | 2006-04-19 | — | — | EP | disclosed |
| US-20040087740-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-05-06 | — | — | US | disclosed |
| EP-1411101-A1 | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-04-21 | — | — | EP | disclosed |
| EP-0443344-B1 | Epoxy resin systems containing methyl-2,6-cyclohexanediamine | AIR PROD & CHEM (US) | 1994-12-07 | — | — | EP | disclosed |
| US-5302672-A | Heat resistance | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1994-04-12 | — | — | US | disclosed |
| US-5066764-A | Curing agent for polyepoxide resins | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1991-11-19 | — | — | US | disclosed |
| EP-0443344-A2 | Epoxy resin systems containing methyl-2,6-cyclohexanediamine | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1991-08-28 | — | — | EP | disclosed |
| US-5025078-A | Curing agent; heat resistance, elongation and toughness | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1991-06-18 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250320180-A1 | HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT | RAD51, SEM1, GFER | MEN1 3384/4885KMT2A 1565/4885KDM4E 756/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.