SCHEMBL4057744

SCHEMBL4057744

CC(=CCO)C(=O)Oc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ELANE P08246 3/20 0.42
MAPT P10636 3/20 0.40
ALDH1A1 P00352 2/20 0.40
HSP90AA1 P07900 1/20 0.39
GAA P10253 1/20 0.39
L3MBTL1 Q9Y468 3/20 0.38
ATM Q13315 2/20 0.38
TDP1 Q9NUW8 1/20 0.38
HTR1A P08908 1/20 0.38
MTNR1A P48039 1/20 0.38
MTNR1B P49286 1/20 0.38
KMT2A Q03164 1/20 0.37
ALOX15 P16050 2/20 0.37
HPGD P15428 1/20 0.37
HSD17B10 Q99714 1/20 0.37
BACE1 P56817 1/20 0.37
CYP19A1 P11511 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7180695 0.86 ELANE (0.41) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL432377 0.86 ELANE (0.42) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL9116035 0.84 AOC3 (0.44) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL6427244 0.84 ELANE (0.45) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL27085736 0.84 ELANE (0.41) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL2810165 0.83 ELANE (0.39) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL8841068 0.83 ELANE (0.44) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL27918620 0.83 KMT2A (0.41) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL7751273 0.83 ELANE (0.41) ELANEMAPTALDH1A1HSP90AA1GAA
SCHEMBL20542045 0.82 ELANE (0.38) ELANEMAPTALDH1A1HSP90AA1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1779568-B Hardenable resin composition, hardened body thereof, and printed wiring board TAIYO INK MFG CO LTD 2010-10-06 CN disclosed
CN-101073037-B Photosensitive resin composition, cured product thereof, and method for producing printed wiring board using same SHOWA DENKO KK 2010-06-16 CN disclosed
US-7579066-B2 Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth) acrylate polymer and its use SHOWA DENKO K.K. (JP) 2009-08-25 US disclosed
CN-101151580-A Flame-retardant composition for solder resist and cured product thereof SHOWA DENKO KK (JP) 2008-03-26 CN disclosed
CN-101073037-A Photosensitive resin composition, cured product thereof, and method for producing printed wiring board using same SHOWA DENKO KK (JP) 2007-11-14 CN disclosed
US-20070218305-A1 Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same SHOWA DENKO K.K. (JP) 2007-09-20 US disclosed
CN-1306338-C Photosensitive composition, cured article and printed wiring board using the same SHOWA DENKO KK (JP) 2007-03-21 CN disclosed
CN-1282036-C Resist curable resin composition and cured article thereof SHOWA DENKO KK (JP) 2006-10-25 CN disclosed
CN-1779568-A Hardenable resin composition, hardened body thereof, and printed wiring board TAIYO INK MFG CO LTD (JP) 2006-05-31 CN disclosed
CN-1729429-A Color filter black matrix resist composition and carbon black dispersion composition for the same SHOWA DENKO KK (JP) 2006-02-01 CN disclosed
CN-1726434-A Color filter black matrix photoresist composition SHOWA DENKO KK (JP) 2006-01-25 CN disclosed
CN-1464996-A resist curable resin composition and cured product thereof SHOWA DENKO KK (JP) 2003-12-31 CN disclosed
CN-1392971-A Photosensitive composition, cured article thereof, and printed circuit board using same SHOWA DENKO KK (JP) 2003-01-22 CN disclosed