SCHEMBL4059099

SCHEMBL4059099

CCCCCC[N+](CCCC)(CCCC)CCCCCC

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ SLC22A1 O15245 3/20 0.93
▸ ALDH1A1 P00352 1/20 0.87
▸ TP53 P04637 1/20 0.87
▸ CYP3A4 P08684 1/20 0.87
▸ ALOX15 P16050 1/20 0.87
▸ TSHR P16473 1/20 0.87
▸ ALOX12 P18054 1/20 0.87
▸ SMN1; SMN2 Q16637 1/20 0.87
▸ HIF1A Q16665 1/20 0.87
▸ HSD17B10 Q99714 1/20 0.87
▸ SLC22A2 O15244 1/20 0.86
▸ DNM1 Q05193 8/20 0.77

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4059060 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL70748 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL13567361 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL1060273 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
Tetrahexylammonium SCHEMBL2521928 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL332137 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL1065743 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL1009645 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL158607 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15
SCHEMBL4685770 1.00 SLC22A1 (0.93) SLC22A1ALDH1A1TP53CYP3A4ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12252632-B2 Chemical-mechanical polishing composition, rinse composition, chemical- mechanical polishing method, and rinsing method ENTEGRIS, INC. (US) 2025-03-18 — — US claimed
US-20220372329-A1 CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD ENTEGRIS, INC. 2022-11-24 — — US claimed
US-12252632-B2 Chemical-mechanical polishing composition, rinse composition, chemical- mechanical polishing method, and rinsing method ENTEGRIS, INC. (US) 2025-03-18 — — US disclosed
US-20220372329-A1 CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD ENTEGRIS, INC. 2022-11-24 — — US disclosed
CN-114258421-A Chemical mechanical polishing composition, cleaning composition, chemical mechanical polishing method and cleaning method CMC材料株式会社 2022-03-29 — — CN disclosed
WO-2020255862-A1 CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD 日本キャボット・マイクロエレクトロニクス株式会社 2020-12-24 — — WO disclosed
WO-2009040107-A2 METHOD FOR THE PRODUCTION OF METAL-CONTAINING NANOPARTICLES ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG (DE) 2009-04-02 — — WO disclosed
WO-2009024312-A2 METHOD FOR THE PRODUCTION AND STABILIZATION OF FUNCTIONAL METAL NANOPARTICLES IN IONIC LIQUIDS ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG (DE) 2009-02-26 — — WO disclosed
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