SCHEMBL4069763

SCHEMBL4069763

O=[PH](O)CCC[PH](=O)O.[MgH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL345435 0.96
SCHEMBL4076796 0.92
SCHEMBL1657779 0.92
SCHEMBL2163335 0.92
SCHEMBL2519667 0.88
SCHEMBL17184040 0.81
SCHEMBL439693 0.79
SCHEMBL8652809 0.79
SCHEMBL4629144 0.76
SCHEMBL341549 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250122375-A1 POLY(ARYLENE ETHER) RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME LG CHEM, LTD. (KR) 2025-04-17 US disclosed
EP-4375331-A1 POLY(ARYLENE ETHER) RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED ARTICLE MANUFACTURED THEREFROM LG CHEM, LTD. (KR) 2024-05-29 EP disclosed
WO-2024048976-A1 POLY(ARYLENE ETHER) RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED ARTICLE MANUFACTURED THEREFROM (주) 엘지화학 2024-03-07 WO disclosed
WO-2022124513-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED PRODUCT MANUFACTURED THEREFROM (주) 엘지화학 2022-06-16 WO disclosed
EP-1950249-B1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE ASAHI KASEI CHEMICALS CORP (JP) 2015-05-06 EP disclosed
EP-1950248-B1 HEAT-RESISTANT RESIN COMPOSITION ASAHI KASEI CHEMICALS CORP (JP) 2014-01-22 EP disclosed
US-8263697-B2 Heat-resistant resin composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2012-09-11 US disclosed
US-20090305016-A1 Heat-Resistant Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-12-10 US disclosed
US-20090029138-A1 Resin Composition Having Excellent Heat Resistance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-01-29 US disclosed
EP-1950249-A1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1950248-A1 HEAT-RESISTANT RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed