Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | THRB | P10828 | 1/20 | 0.33 |
| ▸ | DNM1 | Q05193 | 8/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2120552 | 1.00 | TSHR (0.33) | TSHRTHRBDNM1MEN1KMT2A | |
| SCHEMBL902475 | 1.00 | TSHR (0.33) | TSHRTHRBDNM1MEN1KMT2A | |
| SCHEMBL17002621 | 1.00 | TSHR (0.33) | TSHRTHRBDNM1MEN1KMT2A | |
| SCHEMBL2124363 | 1.00 | TSHR (0.33) | TSHRTHRBDNM1MEN1KMT2A | |
| SCHEMBL2124516 | 0.98 | TSHR (0.32) | TSHRTHRBDNM1MEN1KMT2A | |
| SCHEMBL4554669 | 0.98 | — | — | |
| Hydrochloric Acid SCHEMBL13274431 | 0.90 | — | — | |
| Iodide SCHEMBL16163920 | 0.90 | — | — | |
| Bromide SCHEMBL4479555 | 0.89 | — | — | |
| SCHEMBL9935805 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024043165-A1 | CURABLE COMPOSITION AND COMPOSITE MATERIAL | 日東電工株式会社 | 2024-02-29 | — | — | WO | disclosed |
| CN-115910936-A | Sealing resin sheet and electronic component device | 日东电工株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-115485820-A | Method for producing cured resin sheet with electrode, and thermosetting resin sheet | 日东电工株式会社 | 2022-12-16 | — | — | CN | disclosed |
| CN-115377016-A | Sealing resin sheet and electronic component device | 日东电工株式会社 | 2022-11-22 | — | — | CN | disclosed |
| WO-2022190898-A1 | METHOD FOR MANUFACTURING CURED RESIN SHEET WITH ELECTRODE, CURED RESIN SHEET WITH ELECTRODE, AND THERMOSETTING RESIN SHEET | 日東電工株式会社 | 2022-09-15 | — | — | WO | disclosed |
| CN-114174424-A | Sealing resin sheet | 日东电工株式会社 | 2022-03-11 | — | — | CN | disclosed |
| CN-114174421-A | Sealing resin sheet | 日东电工株式会社 | 2022-03-11 | — | — | CN | disclosed |
| CN-114144468-A | Sealing resin sheet | 日东电工株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114144469-A | Sealing resin sheet | 日东电工株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114096412-A | Multilayer resin sheet for sealing | 日东电工株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-114080427-A | Sealing resin sheet | 日东电工株式会社 | 2022-02-22 | — | — | CN | disclosed |
| US-9074083-B2 | Polyolefin resin composition for metal coating, and resin film and resin-coated metal material using the same | NIPPON STEEL & SUMITOMO METAL CORPORATION (JP) | 2015-07-07 | — | — | US | disclosed |
| WO-2009024312-A2 | METHOD FOR THE PRODUCTION AND STABILIZATION OF FUNCTIONAL METAL NANOPARTICLES IN IONIC LIQUIDS | ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG (DE) | 2009-02-26 | — | — | WO | disclosed |
| US-20080075962-A1 | Polyolefin-Based Resin Composition for Metal Coating, and Resin Film and Resin-Coated Metal Material Using the Same | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2008-03-27 | — | — | US | disclosed |
| WO-2006131234-A1 | COSMETIC COMPOSITIONS COMPRISING IONIC LIQUIDS | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2006-12-14 | — | — | WO | disclosed |