⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4408905 | 0.92 | — | — | |
| Potassium Ion SCHEMBL7861827 | 0.92 | — | — | |
| SCHEMBL11677710 | 0.92 | — | — | |
| SCHEMBL4823906 | 0.92 | — | — | |
| SCHEMBL4074588 | 0.92 | — | — | |
| SCHEMBL11679695 | 0.92 | — | — | |
| SCHEMBL4068319 | 0.92 | — | — | |
| SCHEMBL7854946 | 0.92 | — | — | |
| SCHEMBL9583828 | 0.92 | — | — | |
| SCHEMBL11677345 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109306176-B | Flame-retardant polyamide resin composition and preparation method thereof | 东华大学 | 2020-05-05 | — | — | CN | disclosed |
| EP-1950249-B1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | ASAHI KASEI CHEMICALS CORP (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-1950248-B1 | HEAT-RESISTANT RESIN COMPOSITION | ASAHI KASEI CHEMICALS CORP (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-8263697-B2 | Heat-resistant resin composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20090305016-A1 | Heat-Resistant Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-12-10 | — | — | US | disclosed |
| US-20090029138-A1 | Resin Composition Having Excellent Heat Resistance | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-1950248-A1 | HEAT-RESISTANT RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| EP-1950249-A1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| US-5205951-A | Reduced wall current | CHEVRON RESEARCH AND TECHNOLOGY COMPANY (US) | 1993-04-27 | — | — | US | disclosed |
| US-4056588-A | Bonded particulate ceramic materials and their manufacture | IMI (TAMI) INSTITUTE FOR RESEARCH AND DEVELOPMENT (IL) | 1977-11-01 | — | — | US | disclosed |