SCHEMBL4076455

SCHEMBL4076455

C=CC(=O)OCC(O)COC

nearest known ligand 0.59

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.59
HPGD P15428 2/20 0.47
ALDH1A1 P00352 5/20 0.47
TP53 P04637 3/20 0.47
HIF1A Q16665 3/20 0.47
CYP3A4 P08684 3/20 0.47
HSD17B10 Q99714 1/20 0.47
THRB P10828 2/20 0.40
SMN1; SMN2 Q16637 3/20 0.38
MAPK1 P28482 1/20 0.38
MAPT P10636 2/20 0.35
USP2 O75604 1/20 0.35
KDM4E B2RXH2 1/20 0.33
LMNA P02545 1/20 0.33
CYP1A2 P05177 1/20 0.33
ADRB2 P07550 1/20 0.30
ADRB1 P08588 1/20 0.30
ADRB3 P13945 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22198348 0.90 TSHR (0.49) TSHRHPGDALDH1A1TP53HIF1A
Methacrylic Acid SCHEMBL10798605 0.90 TSHR (0.49) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL95157 0.89 TSHR (0.64) TSHRHPGDALDH1A1TP53HIF1A
Acrylic Acid Methyl Ester SCHEMBL27859782 0.88 TSHR (0.59) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL13038683 0.88 TSHR (0.50) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL15132268 0.85 TSHR (0.52) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL12629198 0.84 TSHR (0.57) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL3410378 0.84 TSHR (0.59) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL9418348 0.84 TSHR (0.57) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1723604 0.83 TSHR (0.57) TSHRHPGDALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 220 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117555204-B Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board 明士(北京)新材料开发有限公司 2024-04-26 CN claimed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-117430812-B Photosensitive polyamic acid ester resin, resin composition and application 明士(北京)新材料开发有限公司 2024-03-19 CN claimed
CN-117555204-A Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board 明士(北京)新材料开发有限公司 2024-02-13 CN claimed
CN-117430812-A Photosensitive polyamic acid ester resin, resin composition and application 明士(北京)新材料开发有限公司 2024-01-23 CN claimed
CN-117384378-A Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-12 CN claimed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-116577965-B Negative photosensitive solid adhesive film and preparation method thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116836388-A Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116577965-A Negative photosensitive solid adhesive film and preparation method thereof 明士(北京)新材料开发有限公司 2023-08-11 CN claimed
CN-115437218-A Photosensitive resin with symmetrical and asymmetrical structures and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-12-06 CN claimed
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-112279959-B Ophthalmic polymer material, method for the production and use thereof 康小林 2022-05-03 CN claimed
CN-114280887-A Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof 明士(北京)新材料开发有限公司 2022-04-05 CN claimed
EP-0596023-B1 PAINT COMPOSITION HEMPELS SKIBSFARVE FAB J C (DK) 1998-10-14 EP claimed
CN-122085600-A Negative photosensitive resin composition and preparation method and application thereof 2026-05-26 CN disclosed
US-4424328-A POLYMERS OF UNSATURATED MULTIFUNCTIONAL POLYSILOXANES POLYMER TECHNOLOGY CORPORATION (US) 1984-01-03 US disclosed
US-4148967-A Metallized plastic molded product and method for producing same MITSUBISHI RAYON CO., LTD. (JP) 1979-04-10 US disclosed