SCHEMBL4079010

SCHEMBL4079010

CO[SiH]([SiH3])OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL109022 0.56
SCHEMBL9788071 0.56
SCHEMBL8415499 0.56
Hydrochloric Acid SCHEMBL3442942 0.53
SCHEMBL1968597 0.53
SCHEMBL25289757 0.53
SCHEMBL3909292 0.53
Water SCHEMBL639453 0.53
SCHEMBL2466191 0.53
Methane SCHEMBL19915300 0.53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106543895-A Novel antifouling dodges coating and preparation method thereof 北京国电富通科技发展有限责任公司 2017-03-29 CN claimed
US-7488693-B2 Method for producing silicon oxide film TOAGOSEI CO., LTD. (JP) 2009-02-10 US claimed
EP-0854891-B1 PROCESS FOR PREPARING COATED PLASTIC SURFACES DOW GLOBAL TECHNOLOGIES INC (US) 2003-05-28 EP claimed
EP-0641820-B1 Organosilicon polymer and process for the preparation thereof TOSHIBA SILICONE (JP) 1998-08-12 EP claimed
US-5489662-A Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1996-02-06 US claimed
EP-0641820-A1 Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1995-03-08 EP claimed
CN-117321766-A Method and application of novel amorphous high-K metal oxide dielectrics by supercritical atomic layer deposition 应用材料公司 2023-12-29 CN disclosed
CN-110105383-B Hydrocarbyloxydisilanes 美国陶氏有机硅公司 2023-04-25 CN disclosed
US-20220402943-A1 HYDROCARBYLOXYDISILANES DDP SPECIALTY ELECTRONIC MAT US 9 LLC (US) 2022-12-22 US disclosed
WO-2022254751-A1 RUBBER COMPOSITION AND TIRE 株式会社ブリヂストン 2022-12-08 WO disclosed
CN-113453791-A Stabilized filter device 海纳有限公司 2021-09-28 CN disclosed
US-11059994-B2 Silicone resin, related methods, and film formed therewith DOW SILICONES CORPORATION (US) 2021-07-13 US disclosed
CN-109075229-B Thermosetting resin composition, substrate for mounting optical semiconductor element, method for producing same, and optical semiconductor device 昭和电工材料株式会社 2021-03-19 CN disclosed
EP-1138633-A1 PROCESS FOR PRODUCING FLUORINATED SILICON COMPOUND Mitsui Chemicals, Inc. (JP) 2001-10-04 EP disclosed
EP-0669363-B1 Process for preparing polyorganosilane TOSHIBA SILICONE (JP) 1999-08-18 EP disclosed
EP-0641820-B1 Organosilicon polymer and process for the preparation thereof TOSHIBA SILICONE (JP) 1998-08-12 EP disclosed
US-5633312-A Process for preparing polyorganosilane TOSHIBA SILICONE CO., LTD. (JP) 1997-05-27 US disclosed
US-5489662-A Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1996-02-06 US disclosed
EP-0669363-A2 Process for preparing polyorganosilane TOSHIBA SILICONE CO., LTD. (JP) 1995-08-30 EP disclosed
EP-0641820-A1 Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1995-03-08 EP disclosed