⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1639944 | 0.79 | — | — | |
| SCHEMBL4816647 | 0.78 | — | — | |
| SCHEMBL1221742 | 0.77 | — | — | |
| SCHEMBL5080670 | 0.73 | — | — | |
| SCHEMBL18043708 | 0.72 | — | — | |
| SCHEMBL1092240 | 0.69 | — | — | |
| SCHEMBL1639257 | 0.67 | — | — | |
| SCHEMBL2231607 | 0.66 | — | — | |
| SCHEMBL28327265 | 0.66 | — | — | |
| SCHEMBL5460542 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 982 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119729322-A | Hearing aid and preparation method thereof | 江苏菲沃泰纳米科技股份有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-118006293-B | UV-curable solvent-free pressure-sensitive adhesive and preparation method thereof | 江苏斯瑞达材料技术股份有限公司 | 2024-12-06 | — | — | CN | claimed |
| WO-2024193157-A1 | METHOD FOR PREPARING LARGE-AREA PATTERNED TIN METAL GRID ELECTRODE AT ROOM TEMPERATURE | 泉州师范学院 | 2024-09-26 | — | — | WO | claimed |
| CN-118580761-A | Photo-curing high-transparency organic-inorganic hybrid coating and preparation method thereof | 无锡海特新材料研究院有限公司 | 2024-09-03 | — | — | CN | claimed |
| CN-117613384-B | Sodium ion battery electrolyte and preparation method thereof | 珠海钠壹新能源科技有限公司 | 2024-07-26 | — | — | CN | claimed |
| WO-2024122103-A1 | ETCHING SOLUTION COMPOSITION | ラサ工業株式会社 | 2024-06-13 | — | — | WO | claimed |
| CN-118006293-A | UV-curable solvent-free pressure-sensitive adhesive and preparation method thereof | 江苏斯瑞达材料技术股份有限公司 | 2024-05-10 | — | — | CN | claimed |
| EP-4350793-A1 | COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC DEVICE USING SAME | Panasonic Holdings Corporation (JP) | 2024-04-10 | — | — | EP | claimed |
| CN-117613384-A | Sodium ion battery electrolyte and preparation method thereof | 珠海钠壹新能源科技有限公司 | 2024-02-27 | — | — | CN | claimed |
| US-20240057367-A1 | COMPOSITION AND METHODS FOR MANUFACTURING ELECTRONIC DEVICE WITH THE COMPOSITION | PANASONIC HOLDINGS CORPORATION (JP) | 2024-02-15 | — | — | US | claimed |
| US-20050153073-A1 | Method for forming ultra low k films using electron beam | APPLIED MATERIALS, INC. | 2005-07-14 | — | — | US | claimed |
| US-6897163-B2 | Method for depositing a low dielectric constant film | APPLIED MATERIALS, INC. (US) | 2005-05-24 | — | — | US | claimed |
| EP-1456434-A1 | A METHOD OF DEPOSITING DIELECTRIC MATERIALS IN DAMASCENE APPLICATIONS | Applied Materials, Inc. (US) | 2004-09-15 | — | — | EP | claimed |
| WO-2004070788-A2 | METHOD FOR DEPOSITING A LOW DIELECTRIC CONSTANT FILM | APPLIED MATERIALS INC. (US) | 2004-08-19 | — | — | WO | claimed |
| US-20040152338-A1 | Method for depositing a low dielectric constant film | APPLIED MATERIALS, INC. | 2004-08-05 | — | — | US | claimed |
| US-20030232495-A1 | Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices | APPLIED MATERIALS, INC. | 2003-12-18 | — | — | US | claimed |
| US-20030211244-A1 | Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric | APPLIED MATERIALS, INC. | 2003-11-13 | — | — | US | claimed |
| US-20030194496-A1 | Methods for depositing dielectric material | APPLIED MATERIALS, INC. | 2003-10-16 | — | — | US | claimed |
| US-20030129827-A1 | Method of depositing dielectric materials in damascene applications | APPLIED MATERIALS, INC. | 2003-07-10 | — | — | US | claimed |
| WO-2003052162-A1 | A METHOD OF DEPOSITING DIELECTRIC MATERIALS IN DAMASCENE APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2003-06-26 | — | — | WO | claimed |