Ethylene

Ethylene

SCHEMBL4170924

C=C.CC(C)OCCOCCOCCOC(C)C

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.32
ADRB2 P07550 1/20 0.30
ADRB1 P08588 1/20 0.30
ADRB3 P13945 1/20 0.30
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL863207 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL987158 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL317547 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL76364 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL863208 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL985625 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL863289 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL987686 0.94 EPHX2 (0.33) EPHX2ADRB2ADRB1ADRB3MEN1
SCHEMBL17133787 0.86
SCHEMBL17133774 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8278021-B2 Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-02 US claimed
US-20090030103-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-29 US claimed
US-10303054-B2 Photosensitive resin composition, photosensitive resin layer using the same and display device SAMSUNG SDI CO., LTD. (KR) 2019-05-28 US disclosed
US-20180196169-A1 HARD-COATING FILM FOR DISPLAY DEVICE, AND DISPLAY DEVICE COMPRISING SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-07-12 US disclosed
EP-3315545-A1 HARD-COATING FILM FOR DISPLAY DEVICE, AND DISPLAY DEVICE COMPRISING SAME Samsung Electronics Co., Ltd. (KR) 2018-05-02 EP disclosed
US-20180017866-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND DISPLAY DEVICE SAMSUNG SDI CO., LTD. (KR) 2018-01-18 US disclosed
US-9599898-B2 Black photosensitive resin composition and light-blocking layer using the same CHEIL INDUSTRIES INC. (KR) 2017-03-21 US disclosed
US-9429842-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device SAMSUNG SDI CO., LTD. (KR) 2016-08-30 US disclosed
US-9405188-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device SAMSUNG SDI CO., LTD. (KR) 2016-08-02 US disclosed
US-9329475-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device CHEIL INDUSTRIES INC. (KR) 2016-05-03 US disclosed
US-20150177617-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device SAMSUNG SDI CO., LTD. (KR) 2015-06-25 US disclosed
US-20090030103-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-29 US disclosed
US-7371698-B2 Method of forming film pattern, active matrix substrate, electro-optic device, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2008-05-13 US disclosed
US-20060270082-A1 METHOD OF FORMING FILM PATTERN, ACTIVE MATRIX SUBSTRATE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2006-11-30 US disclosed
US-20050282021-A1 Composition for forming coating film comprising carbosilane based polymer and coating film obtained from the composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-22 US disclosed
EP-0914393-B1 INK COMPOSITION BIC CORP (US) 2001-09-26 EP disclosed
EP-0914393-A1 INK COMPOSITION BIC CORPORATION (US) 1999-05-12 EP disclosed
US-5769931-A WELAN GUM OR RHAMSAN GUM SHEAR THINNER BIC CORPORATION (US) 1998-06-23 US disclosed
WO-1998004641-A1 INK COMPOSITION BIC CORPORATION (US) 1998-02-05 WO disclosed
US-5466281-A Water-based ink composition for ball-point pen NATIONAL INK INCORPORATED (US) 1995-11-14 US disclosed