⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8865924 | 0.75 | — | — | |
| SCHEMBL10664271 | 0.75 | — | — | |
| SCHEMBL31506740 | 0.75 | — | — | |
| SCHEMBL1042812 | 0.73 | — | — | |
| SCHEMBL19149423 | 0.72 | NPC1 (0.31) | — | |
| SCHEMBL40708 | 0.71 | — | — | |
| SCHEMBL30532723 | 0.71 | — | — | |
| Hydrochloric Acid SCHEMBL29508586 | 0.71 | — | — | |
| SCHEMBL30675167 | 0.71 | — | — | |
| SCHEMBL4788208 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110462797-B | Polishing composition | 福吉米株式会社 | 2023-09-22 | — | — | CN | disclosed |
| WO-2022070516-A1 | METHOD FOR PRODUCING SEMICONDUCTOR WETTING AGENT CONTAINING POLY(VINYL ALCOHOL) COMPOSITION, POLISHING COMPOSITION CONTAINING SEMICONDUCTOR WETTING AGENT OBTAINED USING THIS PRODUCTION METHOD, AND METHOD FOR PRODUCING POLISHING COMPOSITION | 株式会社フジミインコーポレーテッド | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070801-A1 | GRINDING COMPOSITION AND USE THEREOF | 株式会社フジミインコーポレーテッド | 2022-04-07 | — | — | WO | disclosed |
| WO-2022065022-A1 | POLISHING COMPOSITION AND USE THEREFOR | 株式会社フジミインコーポレーテッド | 2022-03-31 | — | — | WO | disclosed |
| WO-2021039585-A1 | POLARIZATION FILM LAMINATE PROVIDED WITH ADHESIVE LAYER, AND OPTICAL DISPLAY PANEL IN WHICH POLARIZATION FILM LAMINATE PROVIDED WITH ADHESIVE LAYER IS USED | 日東電工株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2021039583-A1 | POLARIZING FILM LAMINATE WITH ADHESIVE LAYER AND OPTICAL DISPLAY PANEL IN WHICH SAID POLARIZING FILM LAMINATE WITH ADHESIVE LAYER IS USED | 日東電工株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2020255921-A1 | POLISHING COMPOSITION | 株式会社フジミインコーポレーテッド | 2020-12-24 | — | — | WO | disclosed |
| EP-0524786-B1 | Hardenable compositions, aqueous gels and processes of making them and applications of said gels | MITSUI CHEMICALS INC (JP) | 2009-02-18 | — | — | EP | disclosed |
| EP-0758658-B1 | Redispersible polymer and production process thereof | MITSUI CHEMICALS INC (JP) | 2003-04-23 | — | — | EP | disclosed |
| US-6090892-A | THE RECURRING UNIT CONTAINS A SPECIFIC AMIDO GROUP AND/OR A PARTICULAR HYDROXYL GROUP AS A PENDANT GROUP. | MITSUI TOATSU CHEMICALS, INC. (JP) | 2000-07-18 | — | — | US | disclosed |
| US-5624998-A | Hardenable composition, aqueous gel and applications | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1997-04-29 | — | — | US | disclosed |
| EP-0758658-A2 | Redispersible polymer and production process thereof | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1997-02-19 | — | — | EP | disclosed |
| US-5519088-A | ACRYLAMIDE DERIVATIVE, METAL PARTICLES, THERMAL INSULATION | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1996-05-21 | — | — | US | disclosed |
| EP-0524786-A1 | Hardenable compositions, aqueous gels and processes of making them and applications of said gels | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-01-27 | — | — | EP | disclosed |