⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23761346 | 0.81 | — | — | |
| SCHEMBL21765998 | 0.67 | — | — | |
| SCHEMBL11005144 | 0.67 | — | — | |
| Methylsulfanylmethane SCHEMBL21485383 | 0.55 | — | — | |
| SCHEMBL141709 | 0.53 | — | — | |
| SCHEMBL14142074 | 0.53 | — | — | |
| SCHEMBL145076 | 0.53 | — | — | |
| SCHEMBL12131743 | 0.50 | — | — | |
| SCHEMBL14545108 | 0.50 | — | — | |
| SCHEMBL824461 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | claimed |
| US-10131817-B2 | Cationically cross-linkable/polymerizable composition comprising an iodonium borate and releasing an acceptable odor | ELKEM SILICONES FRANCE SAS (FR) | 2018-11-20 | — | — | US | disclosed |
| EP-2912075-B1 | CATIONICALLY CROSS-LINKABLE/POLYMERISABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOUR | BLUESTAR SILICONES FRANCE (FR) | 2016-12-14 | — | — | EP | disclosed |
| EP-2904021-B1 | CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL | BLUESTAR SILICONES FRANCE (FR) | 2016-12-07 | — | — | EP | disclosed |
| US-9353257-B2 | Cationically cross-linkable/polymerizable organic resin composition comprising an iodonium borate and having an acceptable smell | BLUESTAR SILICONES FRANCE SAS (FR) | 2016-05-31 | — | — | US | disclosed |
| EP-2912075-A1 | CATIONICALLY CROSS-LINKABLE/POLYMERISABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOUR | Bluestar Silicones France SAS (FR) | 2015-09-02 | — | — | EP | disclosed |
| US-20150240069-A1 | CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL | BLUESTAR SILICONES FRANCE SAS (FR) | 2015-08-27 | — | — | US | disclosed |
| US-20150232700-A1 | CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOR | ELKEM SILICONES FRANCE SAS (FR) | 2015-08-20 | — | — | US | disclosed |
| EP-2904021-A1 | CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL | Bluestar Silicones France SAS (FR) | 2015-08-12 | — | — | EP | disclosed |
| US-6617401-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | disclosed |
| US-20030071367-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071368-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071366-A1 | For encapsulating a solid state device, such as a light emitting diode | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| EP-1285938-A1 | Epoxy resin encapsulation compositions | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| EP-1285939-A1 | Epoxy resin compositions and solid state devices encapsulated therewith | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | disclosed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | disclosed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | disclosed |