⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4958560 | 0.93 | — | — | |
| SCHEMBL35474 | 0.91 | — | — | |
| SCHEMBL3858969 | 0.88 | — | — | |
| SCHEMBL167855 | 0.88 | — | — | |
| SCHEMBL3863848 | 0.88 | — | — | |
| SCHEMBL3863843 | 0.88 | — | — | |
| SCHEMBL3858971 | 0.88 | — | — | |
| SCHEMBL3859886 | 0.88 | — | — | |
| SCHEMBL3673058 | 0.88 | — | — | |
| SCHEMBL3859883 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | claimed |
| US-20230111586-A1 | CONSUMABLE FOR ANALYTE DETECTION | ALIGHT SCIENCES INC. | 2023-04-13 | — | — | US | disclosed |
| CN-115920796-A | Functionalized surfaces and preparation thereof | 特韦斯特生物科学公司 | 2023-04-07 | — | — | CN | disclosed |
| US-9909986-B2 | Thickness determination and layer characterization using terahertz scanning reflectometry | APPLIED RESEARCH AND PHOTONICS, INC. (US) | 2018-03-06 | — | — | US | disclosed |
| US-20150316475-A1 | THICKNESS DETERMINATION AND LAYER CHARACTERIZATION USING TERAHERTZ SCANNING REFLECTOMETRY | APPLIED RES AND PHOTONICS INC (US) | 2015-11-05 | — | — | US | disclosed |
| US-7575781-B2 | Applying polymer coating to substrate by performing a bake-out cycle with a chemical vapor deposition system and performing a deposition cycle with the chemical vapor deposition system; enhances adherence of the polymeric materials to the surface of the substrate; coating medical equipment, stents | SUR MODICS, INC. (US) | 2009-08-18 | — | — | US | disclosed |
| US-20090169857-A1 | HIGHLY POROUS LAYERS MADE OF MOF MATERIALS AND METHOD FOR PRODUCING SUCH LAYERS | SUD-CHEMIE AG (DE) | 2009-07-02 | — | — | US | disclosed |
| EP-0896502-B1 | Method of treating metal foil for enhancing adhesion | NIKKO MATERIALS USA INC (US) | 2007-10-03 | — | — | EP | disclosed |
| WO-2006022854-A1 | METHOD FOR DEPOSITING A POLYMERIC COATING ON A SUBSTRATE | SURMODICS, INC. (US) | 2006-03-02 | — | — | WO | disclosed |
| US-20060029721-A1 | Method for depositing a polymeric coating on a substrate | BANK OF MONTREAL, AS COLLATERAL AGENT | 2006-02-09 | — | — | US | disclosed |
| EP-0974685-B1 | Method for making a metal foil with improved bonding to substrates | GA TEK INC (US) | 2003-12-03 | — | — | EP | disclosed |
| US-6086743-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS, INC. (US) | 2000-07-11 | — | — | US | disclosed |
| EP-0974685-A1 | Metal foil with improved bonding to substrates and method for making said foil | Gould Electronics Inc. (US) | 2000-01-26 | — | — | EP | disclosed |
| US-5908542-A | CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, | GOULD ELECTRONICS INC. (US) | 1999-06-01 | — | — | US | disclosed |
| US-5885436-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS INC. (US) | 1999-03-23 | — | — | US | disclosed |
| EP-0896502-A1 | Method of treating metal foil for enhancing adhesion | Gould Electronics Inc. (US) | 1999-02-10 | — | — | EP | disclosed |