SCHEMBL4190504

SCHEMBL4190504

CC=C(CC)C(S)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RNPEP Q9H4A4 2/20 0.39
FFAR3 O14843 1/20 0.35
ACE P12821 3/20 0.34
MME P08473 2/20 0.34
CPA1 P15085 2/20 0.34
ACE2 Q9BYF1 2/20 0.34
TDP1 Q9NUW8 4/20 0.33
HPGD P15428 2/20 0.33
HSD17B10 Q99714 2/20 0.33
ALDH1A1 P00352 2/20 0.33
MAPT P10636 2/20 0.33
LMNA P02545 2/20 0.33
ABCB11 O95342 1/20 0.33
F2 P00734 1/20 0.33
TP53 P04637 1/20 0.33
KDM4E B2RXH2 1/20 0.33
MEN1 O00255 1/20 0.33
ALOX15 P16050 1/20 0.33
KMT2A Q03164 1/20 0.33
DUSP3 P51452 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1463309 0.75 FFAR3 (0.38) RNPEPFFAR3TDP1ALDH1A1TP53
SCHEMBL29124291 0.75 FFAR3 (0.38) RNPEPFFAR3TDP1ALDH1A1TP53
SCHEMBL29227706 0.72
SCHEMBL12213202 0.69
Propionic Acid SCHEMBL29055918 0.68
SCHEMBL17594888 0.67 FFAR3 (0.31) FFAR3
Propionic Acid SCHEMBL28218895 0.67
SCHEMBL830552 0.66
Propionic Acid SCHEMBL28960995 0.66 FFAR3 (0.62) RNPEPFFAR3ACEMMECPA1
Propionic Acid SCHEMBL27963998 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7622516-B1 Composition of epoxy and anhydride components, antioxidant and phosphor material HENKEL CORPORATION (US) 2009-11-24 US claimed
EP-1831281-A1 OPTOELECTRONIC MOLDING COMPOUND THAT TRANSMITS VISIBLE LIGHT AND BLOCKS INFRARED LIGHT Henkel Corporation (US) 2007-09-12 EP claimed
WO-2006073608-A1 OPTOELECTRONIC MOLDING COMPOUND THAT TRANSMITS VISIBLE LIGHT AND BLOCKS INFRARED LIGHT HENKEL CORPORATION (US) 2006-07-13 WO claimed
US-20040063840-A1 Epoxy molding compounds with resistance to UV light and heat HENKEL LOCTITE CORPORATION 2004-04-01 US claimed
WO-2016074207-A1 WHITE EPOXY MOULDING COMPOUND ABLESTIK (SHANGHAI) LTD (CN) 2016-05-19 WO disclosed
US-7622516-B1 Composition of epoxy and anhydride components, antioxidant and phosphor material HENKEL CORPORATION (US) 2009-11-24 US disclosed
US-7474009-B2 Optoelectronic molding compound that transmits visible light and blocks infrared light HENKEL CORPORATION (US) 2009-01-06 US disclosed
EP-1831281-A1 OPTOELECTRONIC MOLDING COMPOUND THAT TRANSMITS VISIBLE LIGHT AND BLOCKS INFRARED LIGHT Henkel Corporation (US) 2007-09-12 EP disclosed
US-7125917-B2 Epoxy molding compounds with resistance to UV light and heat HENKEL CORPORATION (US) 2006-10-24 US disclosed
WO-2006073608-A1 OPTOELECTRONIC MOLDING COMPOUND THAT TRANSMITS VISIBLE LIGHT AND BLOCKS INFRARED LIGHT HENKEL CORPORATION (US) 2006-07-13 WO disclosed
US-20060147718-A1 Optoelectronic molding compound that transmits visible light and blocks infrared light HENKEL CORPORATION (US) 2006-07-06 US disclosed
US-20040063840-A1 Epoxy molding compounds with resistance to UV light and heat HENKEL LOCTITE CORPORATION 2004-04-01 US disclosed