SCHEMBL419163

SCHEMBL419163

Nc1nccc(O)c1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29668482 1.00
SCHEMBL2360937 0.79
SCHEMBL9670441 0.79
SCHEMBL25914919 0.75
SCHEMBL28820820 0.75
SCHEMBL19899743 0.75
SCHEMBL27959018 0.75
SCHEMBL31148190 0.75
SCHEMBL27975774 0.75
SCHEMBL29655645 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116322616-A Hair lightening compositions providing damage protection and sensory benefits and methods of use 欧莱雅 2023-06-23 CN disclosed
CN-110115116-B Method for forming solderable solder deposits on contact pads 德国艾托特克公司 2022-05-27 CN disclosed
US-11032914-B2 Method of forming a solderable solder deposit on a contact pad ATOTECH DEUTSCHLAND GMBH (DE) 2021-06-08 US disclosed
EP-3560304-B1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH DEUTSCHLAND GMBH (DE) 2021-02-03 EP disclosed
US-20190350088-A1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2019-11-14 US disclosed
EP-3560304-A1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH Deutschland GmbH (DE) 2019-10-30 EP disclosed
CN-110115116-A Method for forming solderable solder deposits on contact pads 德国艾托特克公司 2019-08-09 CN disclosed
EP-2377376-B1 METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES ATOTECH DEUTSCHLAND GMBH (DE) 2019-08-07 EP disclosed
EP-2520977-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-11-22 EP disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 US disclosed
WO-2010046235-A1 METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES ATOTECH DEUTSCHLAND GMBH (DE) 2010-04-29 WO disclosed
WO-2009153516-A1 NOVEL DERIVATIVES OF PYRROLOINDOLE INHIBITORS OF HSP90, COMPOSITIONS CONTAINING SAME, AND USE THEREOF SANOFI-AVENTIS (FR) 2009-12-23 WO disclosed
WO-2009122034-A2 NOVEL HSP90 INHIBITORY CARBAZOLE DERIVATIVES, COMPOSITIONS CONTAINING SAME, AND USE THEREOF SANOFI-AVENTIS (FR) 2009-10-08 WO disclosed
US-20080275154-A1 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition SAKAYORI KATSUYA 2008-11-06 US disclosed
US-7410746-B2 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition DAI NIPPON PRINTING CO., LTD. (JP) 2008-08-12 US disclosed
US-20070049599-A1 Use of bh4 for the treatment of respiratory diseases ALTANA PHARMA AG (DE) 2007-03-01 US disclosed
EP-1682148-A1 USE OF BH4 FOR THE TREATMENT OF RESPIRATORY DISEASES ALTANA Pharma AG (DE) 2006-07-26 EP disclosed
WO-2005041975-A1 USE OF BH4 FOR THE TREATMENT OF RESPIRATORY DISEASES ALTANA PHARMA AG (DE) 2005-05-12 WO disclosed
US-20040023159-A1 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition DAI NIPPON PRINTING CO., LTD. (JP) 2004-02-05 US disclosed
US-6524770-B1 For polyimide precursor curable under patternwise low radiation; heat and chemical resistance; polyamide having unsaturated ester pendant groups cures HITACHI CHEMICAL CO., LTD. (JP) 2003-02-25 US disclosed