SCHEMBL4194682

SCHEMBL4194682

CO[Si](CCC(F)(F)F)(CCC(F)(F)F)CCC(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14265473 0.91
SCHEMBL14265476 0.91
SCHEMBL14265468 0.89
SCHEMBL14265469 0.87
SCHEMBL14265502 0.85
SCHEMBL14265501 0.83
SCHEMBL14265477 0.82
SCHEMBL14265482 0.82
SCHEMBL14265485 0.82
SCHEMBL14265483 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0974596-B1 Method for preparation of alkoxysilanes having reduced halide content DOW CORNING (US) 2003-03-05 EP claimed
EP-0974596-A2 Method for preparation of alkoxysilanes having reduced halide content DOW CORNING CORPORATION (US) 2000-01-26 EP claimed
EP-2032588-B1 METHOD FOR PREPARATION OF ALKOXYSILANES HAVING REDUCED HALIDE CONTENT DOW CORNING (US) 2012-08-08 EP disclosed
WO-2012091154-A1 METHOD OF PRODUCING A HYDROLYZABLE SILICON-CONTAINING COMPOUND WASEDA UNIVERSITY (JP) 2012-07-05 WO disclosed
US-20090270646-A1 METHOD FOR PREPARATION OF ALKOXYSILANES HAVING REDUCED HALIDE DOW CORNING CORPORATION 2009-10-29 US disclosed
EP-2032588-A2 METHOD FOR PREPARATION OF ALKOXYSILANES HAVING REDUCED HALIDE CONTENT Dow Corning Corporation (US) 2009-03-11 EP disclosed
US-7344235-B2 Ink composition for ink jet recording, ink cartridge, nozzle plate for ink jet recording, ink jet head, and recording apparatus MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2008-03-18 US disclosed
WO-2007149201-A2 METHOD FOR PREPARATION OF ALKOXYSILANES HAVING REDUCED HALIDE CONTENT DOW CORNING CORPORATION (US) 2007-12-27 WO disclosed
US-20050118742-A1 Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device ROBERT BOSCH GMBH (DE) 2005-06-02 US disclosed
EP-0974596-B1 Method for preparation of alkoxysilanes having reduced halide content DOW CORNING (US) 2003-03-05 EP disclosed
EP-0974596-A2 Method for preparation of alkoxysilanes having reduced halide content DOW CORNING CORPORATION (US) 2000-01-26 EP disclosed
EP-0679654-B1 Process for preparation of organooxysilanes DOW CORNING (US) 1999-07-07 EP disclosed
US-5914421-A Method for preparation of alkoxysilanes having reduced halide content DOW CORNING CORPORATION (US) 1999-06-22 US disclosed
EP-0679654-A1 Process for preparation of organooxysilanes DOW CORNING CORPORATION (US) 1995-11-02 EP disclosed
US-5374761-A Process for preparation of organooxysilanes CORNING CORPORATION (US) 1994-12-20 US disclosed
US-5068387-A Siloxanes as monomers for copolymers or as couplers DOW CORNING CORPORATION (US) 1991-11-26 US disclosed
EP-0430272-A2 Production of organofunctional alkoxysilanes DOW CORNING CORPORATION (US) 1991-06-05 EP disclosed