Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 12/20 | 1.00 |
| ▸ | CASP2 | P42575 | 1/20 | 0.61 |
| ▸ | EPHX2 | P34913 | 6/20 | 0.59 |
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.57 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.57 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11258951 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL8393794 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL9659414 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL25227097 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL8377308 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL25228476 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL8393740 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL8392177 | 1.00 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL25225195 | 0.97 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 | |
| SCHEMBL25229277 | 0.97 | EPHX1 (1.00) | EPHX1CASP2EPHX2ZDHHC20ZDHHC2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7084192-B2 | Polylactic acid composite material and molded body | Kabushiki Kaisha Toyota Chuo Kankyusho (JP) | 2006-08-01 | — | — | US | claimed |
| JP-11265621-A | — | — | None | — | — | JP | disclosed |
| JP-62033670-A | — | — | None | — | — | JP | disclosed |
| JP-63174063-A | — | — | None | — | — | JP | disclosed |
| EP-4006103-B1 | POLYESTER RESIN COMPOSITION AND MOLDED PRODUCT THEREOF | TORAY INDUSTRIES (JP) | 2025-11-05 | — | — | EP | disclosed |
| CN-119505192-A | Polyester resin, polyester resin composition and molded product thereof | 东丽先端材料研究开发（中国）有限公司 | 2025-02-25 | — | — | CN | disclosed |
| US-20250048560-A1 | COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING AGENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-02-06 | — | — | US | disclosed |
| US-12138714-B2 | Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package | ORIGIN COMPANY, LIMITED (JP) | 2024-11-12 | — | — | US | disclosed |
| US-20240365476-A1 | COATING AGENT AND METHOD FOR MANUFACTURING ELECTRONIC MODULE USING THE COATING AGENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-10-31 | — | — | US | disclosed |
| CN-118755080-A | Preparation method of polyamide 66 with high strength and high elongation at break | 江苏扬农化工集团有限公司 | 2024-10-11 | — | — | CN | disclosed |
| JP-H11265621-A | INSULATED POWER CABLE AND ITS CONNECTING PART | FUJIKURA LTD | 1999-09-28 | — | — | JP | disclosed |
| EP-0737714-B1 | FLUORORUBBER COMPOSITION AND MOLDING THEREOF | DAIKIN IND LTD (JP) | 1999-09-15 | — | — | EP | disclosed |
| US-5891941-A | BLEND CONTAINING VULCANIZING AGENT AND FATTY AMIDE | DAIKIN INDUSTRIES LTD. (JP) | 1999-04-06 | — | — | US | disclosed |
| US-5679615-A | MULTILAYER; SUPPORT, COLOR FORMERS, PHENOLIC COMPOUND AND THERMOPLASTIC RESIN | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-10-21 | — | — | US | disclosed |
| EP-0780428-A1 | Process for preparing formed item of aliphatic polyester and formed item prepared by the process | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1997-06-25 | — | — | EP | disclosed |
| US-5604175-A | LOW MOLECULAR WEIGHT ORGANIC COMPOUND CAPABLE IMPARTING ORIENTATION TO A MELT OF LOW MOLECUALR WEIGHT KETONES; ERASING | NITTO DENKO CORPORATION (JP) | 1997-02-18 | — | — | US | disclosed |
| EP-0737714-A1 | FLUORORUBBER COMPOSITION AND MOLDING THEREOF | DAIKIN INDUSTRIES, LIMITED (JP) | 1996-10-16 | — | — | EP | disclosed |
| EP-0624481-A2 | Reversible heat-sensitive recording medium | NITTO DENKO CORPORATION (JP) | 1994-11-17 | — | — | EP | disclosed |
| JP-S63174063-A | DRY PROCESS TONER | FUJI XEROX CO LTD | 1988-07-18 | — | — | JP | disclosed |
| JP-S6233670-A | HEAT SENSITIVE RECORDING MATERIAL | RICOH CO LTD | 1987-02-13 | — | — | JP | disclosed |