SCHEMBL424729

SCHEMBL424729

[Pr].[Si].[Zr]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7761620 1.00
SCHEMBL28014152 0.82
SCHEMBL4529358 0.82
SCHEMBL27939956 0.82
SCHEMBL1553527 0.82
SCHEMBL25366216 0.82
SCHEMBL4529363 0.82
SCHEMBL150461 0.82
SCHEMBL150462 0.82
SCHEMBL23199768 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112852257-B Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2022-06-07 CN disclosed
CN-107434945-B Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2022-02-25 CN disclosed
CN-107434944-B Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2022-01-28 CN disclosed
CN-112852257-A Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2021-05-28 CN disclosed
CN-112778876-A Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2021-05-11 CN disclosed
CN-104946160-B Adhesive composition and adhesive tape 日东电工(上海松江)有限公司 2019-09-13 CN disclosed
CN-107434945-A Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2017-12-05 CN disclosed
CN-107434944-A Nonaqueous dispersion of fluorine-containing resin, heat-curable resin composition of fluorine-containing resin using same, and cured product thereof 三菱铅笔株式会社 2017-12-05 CN disclosed
CN-104946160-A Adhesive composition and adhesive tape NITTO DENKO SHANGHAI SONGJIANG CO LTD 2015-09-30 CN disclosed
US-20120021211-A1 LAMINATED SHEET FOR BURNING HAVING MARKING PART YUSHI-SEIHIN CO., LTD. (JP) 2012-01-26 US disclosed
US-6090483-A COMPRISING LAYER TO BE PRINTED IN WHICH SURFACE PORTION IS FORMED OF POLYOLEFIN LAYER, AND ADHESIVE LAYER NITTO DENKO CORPORATION (JP) 2000-07-18 US disclosed
EP-0988992-A1 Printing sheet for forming high temperature resistant labels NITTO DENKO CORPORATION (JP) 2000-03-29 EP disclosed
EP-0601317-B1 Label NITTO DENKO CORP (JP) 1999-04-21 EP disclosed
EP-0854051-A1 Printable adhesive sheet and label NITTO DENKO CORPORATION (JP) 1998-07-22 EP disclosed
US-5780142-A Pattern-forming sheet and label comprising same NITTO DENKO CORPORATION (JP) 1998-07-14 US disclosed
CN-1165358-A Pattern-forming sheet and label comprising same NITTO DENKO CORP (JP) 1997-11-19 CN disclosed
US-5578365-A Label substrate ink and label NITTO DENKO CORPORATION (JP) 1996-11-26 US disclosed
EP-0741050-A2 Pattern-forming sheet and label comprising same NITTO DENKO CORPORATION (JP) 1996-11-06 EP disclosed
EP-0601317-A2 Label substrate, ink, and label NITTO DENKO CORPORATION (JP) 1994-06-15 EP disclosed
EP-0570926-A1 Pattern-forming sheet NITTO DENKO CORPORATION (JP) 1993-11-24 EP disclosed