SCHEMBL4249650

SCHEMBL4249650

C=CC(=O)OCCC[Si](OCC)(OCC)OCCC

nearest known ligand 0.57

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.57
HPGD P15428 1/20 0.57
ALDH1A1 P00352 5/20 0.49
CYP3A4 P08684 2/20 0.49
TP53 P04637 3/20 0.41
HIF1A Q16665 3/20 0.41
HSD17B10 Q99714 1/20 0.41
ATM Q13315 1/20 0.40
THRB P10828 3/20 0.39
HCAR2 Q8TDS4 4/20 0.36
MAPK1 P28482 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
MAPT P10636 1/20 0.32
RAB9A P51151 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
APP P05067 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL949700 0.95 TSHR (0.62) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL93561 0.94 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL31186299 0.93 TSHR (0.65) TSHRHPGDALDH1A1CYP3A4TP53
Hydrogen Peroxide SCHEMBL28128571 0.92 TSHR (0.58) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL2220386 0.92 TSHR (0.58) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL18040479 0.91 TSHR (0.56) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL28013523 0.91 TSHR (0.51) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL221202 0.89 TSHR (0.54) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL48909 0.89 TSHR (0.58) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL4585244 0.88 TSHR (0.53) TSHRHPGDALDH1A1CYP3A4TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103270061-B Multistage polymer dispersion and manufacture method thereof and purposes BASF SE (DE) 2016-04-06 CN claimed
CN-104946172-A Pressure-sensitive adhesive composition, pressure-sensitive adhesive polarizing plate and liquid crystal display device SHINETSU CHEMICAL CO 2015-09-30 CN claimed
CN-102046673-B Multipolymer, its manufacture method, oil-repellent composition and process article thereof ASAHI GLASS CO.,LTD. (JP) 2016-02-24 CN disclosed
CN-105308102-A Heat-resistant silane crosslinked resin molded article and method for manufacturing same, and heat-resistant product equipped with heat-resistant silane crosslinked resin molded article FURUKAWA ELECTRIC CO LTD 2016-02-03 CN disclosed
CN-102985496-B Coat system WACKER CHEMIE AG (DE) 2016-01-20 CN disclosed
CN-102844385-B The surface treatment of cement matrix WACKER CHEMIE AG (DE) 2016-01-20 CN disclosed
CN-105102498-A Copolymer and hydrophilic material comprising the same MITSUI CHEMICALS INC 2015-11-25 CN disclosed
CN-103068767-B The purposes of redispersible polymer powder in water in the stability in storage improving cement or dry mortar WACKER CHEMIE AG (DE) 2015-11-25 CN disclosed
CN-105073917-A Film comprising copolymer or composition MITSU CHEMICALS INC 2015-11-18 CN disclosed
CN-104946172-A Pressure-sensitive adhesive composition, pressure-sensitive adhesive polarizing plate and liquid crystal display device SHINETSU CHEMICAL CO 2015-09-30 CN disclosed
CN-104822744-A Production method for moulded body using heat-resistant silane-cross-linkable resin composition FURUKAWA ELECTRIC CO LTD 2015-08-05 CN disclosed
US-8486615-B2 Photopolymerizable silicone materials forming semipermeable membranes for sensor applications DOW CORNING CORPORATION (US) 2013-07-16 US disclosed
US-8377634-B2 Radiation sensitive silicone resin composition DOW CORNING CORPORATION (US) 2013-02-19 US disclosed
US-20090004606-A1 Radiation Sensitive Silicone Resin Composition DOW CORNING CORPORATION (US) 2009-01-01 US disclosed
US-20080277276-A1 Photopolymerizable Silicone Materials Forming Semipermeable Membranes for Sensor Applications DOW CORNING CORPORATION 2008-11-13 US disclosed
EP-1769018-B1 RADIATION SENSITIVE SILICONE RESIN COMPOSITION DOW CORNING (US) 2007-11-21 EP disclosed
EP-1820065-A2 PHOTOPOLYMERIZABLE SILICONE MATERIALS FORMING SEMIPERMEABLE MEMBRANES FOR SENSOR APPLICATIONS Dow Corning Corporation (US) 2007-08-22 EP disclosed
EP-1769018-A1 RADIATION SENSITIVE SILICONE RESIN COMPOSITION Dow Corning Corporation (US) 2007-04-04 EP disclosed
WO-2006023037-A2 PHOTOPOLYMERIZABLE SILICONE MATERIALS FORMING SEMIPERMEABLE MEMBRANES FOR SENSOR APPLICATIONS DOW CORNING CORPORATION (US) 2006-03-02 WO disclosed
WO-2006019468-A1 RADIATION SENSITIVE SILICONE RESIN COMPOSITION DOW CORNING CORPORATION (US) 2006-02-23 WO disclosed