SCHEMBL426324

SCHEMBL426324

C=C[Si](C)(O[Si](C)(C)C)O[Si](C)(C)O[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13204365 0.97
SCHEMBL2178197 0.88
SCHEMBL536602 0.88
SCHEMBL12453338 0.87
SCHEMBL10005623 0.87
SCHEMBL4851011 0.87
SCHEMBL29102225 0.87
SCHEMBL6681777 0.85
SCHEMBL25758711 0.85
SCHEMBL29102223 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12030819-B2 Doped SiC and SiOC compositions and Methods PALLIDUS, INC. (US) 2024-07-09 US disclosed
US-11820666-B2 Polysilocarb based silicon carbide materials, applications and devices PALLIDUS, INC. (US) 2023-11-21 US disclosed
US-11692067-B2 Polysilocarb materials, methods and uses MELIOR INNOVATIONS, INC. (US) 2023-07-04 US disclosed
US-11691925-B2 Nanocomposite silicon oxygen carbon materials and uses MELIOR INNOVATIONS, INC. (US) 2023-07-04 US disclosed
US-20230167580-A1 SiC P-TYPE, AND LOW RESISTIVITY, CRYSTALS, BOULES, WAFERS AND DEVICES, AND METHODS OF MAKING THE SAME PALLIDUS, INC. (US) 2023-06-01 US disclosed
US-20230167582-A1 SiC P-TYPE, AND LOW RESISTIVITY, CRYSTALS, BOULES, WAFERS AND DEVICES, AND METHODS OF MAKING THE SAME PALLIDUS, INC. (US) 2023-06-01 US disclosed
US-20230167583-A1 SiC P-TYPE, AND LOW RESISTIVITY, CRYSTALS, BOULES, WAFERS AND DEVICES, AND METHODS OF MAKING THE SAME PALLIDUS, INC. (US) 2023-06-01 US disclosed
US-20180201546-A1 Pressed and Self Sintered Polymer Derived SiC Materials, Applications and Devices PALLIDUS, INC. (US) 2018-07-19 US disclosed
US-20180194945-A1 Polymer Derived Ceramic Effects Particles, Uses and Methods of Making MELIOR INNOVATIONS, INC. (US) 2018-07-12 US disclosed
US-9944823-B2 Electrical insulation enamels composed of modified polymers and electrical conductors produced therefrom and having improved sliding capacity SCHWERING & HASSE ELEKTRODRAHT GMBH (DE) 2018-04-17 US disclosed
US-20100279469-A1 Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same JIN HWAIL 2010-11-04 US disclosed
US-20100048932-A1 New Heterogenized Rhodium Complexes, Methods of their Synthesis and Application as Hydrosilylation Catalysts ADAM MICKIEWICZ UNIVERSITY (PL) 2010-02-25 US disclosed
US-20090321005-A1 GLASS SUBSTRATE WITH PROTECTIVE GLASS, AND PROCESS FOR PRODUCING DISPLAY DEVICE USING GLASS SUBSTRATE WITH PROTECTIVE GLASS ASAHI GLASS COMPANY, LIMITED (JP) 2009-12-31 US disclosed
US-20090281266-A1 Star silicone resins O'LENICK KEVIN ANTHONY 2009-11-12 US disclosed
US-20090189180-A1 SILICONE RESIN COMPOSITION SEOUL SEMICONDUCTOR CO., LTD. (KR) 2009-07-30 US disclosed
US-20090148682-A1 GLASS SUBSTRATE WITH PROTECTIVE GLASS, PROCESS FOR PRODUCING DISPLAY DEVICE USING GLASS SUBSTRATE WITH PROTECTIVE GLASS, AND SILICONE FOR RELEASE PAPER ASAHI GLASS COMPANY, LIMITED (JP) 2009-06-11 US disclosed
US-20090050851-A1 FLUORESCENT SUBSTANCE CONTAINING RARE EARTH METAL, LUMINOUS COMPOSITION COMPRISING THE SAME, PROCESS FOR MANUFACTURING THEREOF, AND LIGHT-EMITTING ELEMENT COMPRISING THE FLUORESCENT SUBSTANCE KABUSHIKI KAISHA TOSHIBA (JP) 2009-02-26 US disclosed
US-20080220266-A1 SILICONE RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA 2008-09-11 US disclosed
US-20080135175-A1 THIN PLATE GLASS LAMINATE AND PROCESS FOR PRODUCING DISPLAY DEVICE USING THIN PLATE GLASS LAMINATE ASAHI GLASS COMPANY, LIMITED (JP) 2008-06-12 US disclosed
US-20070287771-A1 Silicone ink composition for inkjet printing, and image-forming method SHIN-ETSU CHEMICAL CO., LTD. 2007-12-13 US disclosed