SCHEMBL426859

SCHEMBL426859

CCC(C)O[Ti].CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O

nearest known ligand 0.48

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GAA P10253 4/20 0.48
MGAM O43451 2/20 0.48
SI P14410 2/20 0.48
MGAM2 Q2M2H8 2/20 0.48
LMNA P02545 2/20 0.38
ALDH1A1 P00352 5/20 0.36
TRPA1 O75762 1/20 0.36
HSD17B10 Q99714 1/20 0.35
MAPT P10636 2/20 0.33
L3MBTL1 Q9Y468 2/20 0.33
CYP1A2 P05177 1/20 0.32
TSHR P16473 1/20 0.32
KMT2A Q03164 2/20 0.32
POLB P06746 1/20 0.32
NLRP3 Q96P20 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1133602 0.87 GAA (0.54) GAAMGAMSIMGAM2LMNA
SCHEMBL2586197 0.87 GAA (0.54) GAAMGAMSIMGAM2LMNA
SCHEMBL10578301 0.83 GAA (0.58) GAAMGAMSIMGAM2LMNA
SCHEMBL9507018 0.82 GAA (0.48) GAAMGAMSIMGAM2LMNA
SCHEMBL2592936 0.82 GAA (0.48) GAAMGAMSIMGAM2LMNA
SCHEMBL427710 0.82 GAA (0.48) GAAMGAMSIMGAM2LMNA
SCHEMBL27832220 0.82 GAA (0.48) GAAMGAMSIMGAM2LMNA
SCHEMBL2586879 0.81 GAA (0.47) GAAMGAMSIMGAM2LMNA
SCHEMBL430611 0.81 GAA (0.47) GAAMGAMSIMGAM2LMNA
SCHEMBL9707107 0.81 GAA (0.47) GAAMGAMSIMGAM2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884839-B2 Acetal-protected silanol group-containing polysiloxane composition NISSAN CHEMICAL CORPORATION (JP) 2024-01-30 US disclosed
US-11609499-B2 Silicon-containing coating agent for pattern reversal NISSAN CHEMICAL CORPORATION (JP) 2023-03-21 US disclosed
US-20220155688-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
US-10838303-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having carbonate skeleton NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-11-17 US disclosed
US-20200225584-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2020-07-16 US disclosed
US-10613440-B2 Silicon-containing EUV resist underlayer film-forming composition containing onium sulfonate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-04-07 US disclosed
US-10558119-B2 Composition for coating resist pattern NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-02-11 US disclosed
US-20190339618-A1 SILICON-CONTAINING COATING AGENT FOR PATTERN REVERSAL NISSAN CHEMICAL CORPORATION (JP) 2019-11-07 US disclosed
US-10372040-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having halogen-containing carboxylic acid amide group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2019-08-06 US disclosed
US-20190185707-A1 ACETAL-PROTECTED SILANOL GROUP-CONTAINING POLYSILOXANE COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2019-06-20 US disclosed
EP-1298176-A2 Stacked film insulating film and substrate for semiconductor JSR Corporation (JP) 2003-04-02 EP disclosed
US-20030059550-A1 Method of film formation, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
US-20030059628-A1 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
EP-1296365-A2 Method of film formation, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
EP-1295924-A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030008155-A1 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR CORPORATION (JP) 2003-01-09 US disclosed
EP-1267395-A2 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR Corporation (JP) 2002-12-18 EP disclosed
US-6472079-B2 PRODUCT OF HYDROLYSIS AND CONDENSATION OF AN ORGANOSILICON COMPOUND; 1A OR 2A COMPOUND, ESPECIALLY CARBOXYLIC SALT; SOLVENT; EXCELLENT CRACKING RESISTANCE AFTER A PCT (PRESSURE COOKER TEST). JSR CORPORATION (JP) 2002-10-29 US disclosed
US-20020045693-A1 Composition for film formation, method of film formation and silica-based film JSR CORPORATION (JP) 2002-04-18 US disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed