SCHEMBL427018

SCHEMBL427018

CCCO[Ti].CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O

nearest known ligand 0.52

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.52
MGAM O43451 2/20 0.52
SI P14410 2/20 0.52
MGAM2 Q2M2H8 2/20 0.52
ALDH1A1 P00352 7/20 0.39
TRPA1 O75762 1/20 0.39
LMNA P02545 2/20 0.38
HSD17B10 Q99714 1/20 0.38
MAPT P10636 2/20 0.35
CYP1A2 P05177 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
TSHR P16473 2/20 0.33
KDM4E B2RXH2 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
ALOX15 P16050 1/20 0.33
FAAH O00519 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL431559 0.89 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL2585814 0.88 GAA (0.61) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1697722 0.86 GAA (0.58) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1330478 0.83
SCHEMBL1331371 0.83
SCHEMBL15500 0.83
SCHEMBL1331782 0.83
SCHEMBL1331762 0.83
SCHEMBL1332259 0.83
SCHEMBL1871576 0.83 GAA (0.74) GAAMGAMSIMGAM2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884839-B2 Acetal-protected silanol group-containing polysiloxane composition NISSAN CHEMICAL CORPORATION (JP) 2024-01-30 US disclosed
US-11609499-B2 Silicon-containing coating agent for pattern reversal NISSAN CHEMICAL CORPORATION (JP) 2023-03-21 US disclosed
US-20220155688-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
US-20210124266-A1 PRIMER FOR SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING A PATTERN NISSAN CHEMICAL CORPORATION (JP) 2021-04-29 US disclosed
US-10838303-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having carbonate skeleton NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-11-17 US disclosed
US-20200225584-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2020-07-16 US disclosed
US-10613440-B2 Silicon-containing EUV resist underlayer film-forming composition containing onium sulfonate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-04-07 US disclosed
US-10558119-B2 Composition for coating resist pattern NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-02-11 US disclosed
US-20190339618-A1 SILICON-CONTAINING COATING AGENT FOR PATTERN REVERSAL NISSAN CHEMICAL CORPORATION (JP) 2019-11-07 US disclosed
US-10372040-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having halogen-containing carboxylic acid amide group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2019-08-06 US disclosed
EP-1298176-A2 Stacked film insulating film and substrate for semiconductor JSR Corporation (JP) 2003-04-02 EP disclosed
US-20030059550-A1 Method of film formation, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
US-20030059628-A1 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
EP-1296365-A2 Method of film formation, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
EP-1295924-A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030008155-A1 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR CORPORATION (JP) 2003-01-09 US disclosed
EP-1267395-A2 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR Corporation (JP) 2002-12-18 EP disclosed
US-6472079-B2 PRODUCT OF HYDROLYSIS AND CONDENSATION OF AN ORGANOSILICON COMPOUND; 1A OR 2A COMPOUND, ESPECIALLY CARBOXYLIC SALT; SOLVENT; EXCELLENT CRACKING RESISTANCE AFTER A PCT (PRESSURE COOKER TEST). JSR CORPORATION (JP) 2002-10-29 US disclosed
US-20020045693-A1 Composition for film formation, method of film formation and silica-based film JSR CORPORATION (JP) 2002-04-18 US disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed