Methane

Methane

SCHEMBL4273227

C.O=C(O)CC(C(=O)O)P(=O)(O)O

nearest known ligand 0.58

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Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 7/20 0.58
CA2 P00918 1/20 0.44
CA4 P22748 1/20 0.44
TDP1 Q9NUW8 2/20 0.42
MEN1 O00255 1/20 0.42
LMNA P02545 1/20 0.42
HPGD P15428 1/20 0.42
TSHR P16473 1/20 0.42
BLM P54132 1/20 0.42
KMT2A Q03164 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.40
NAALAD2 Q9Y3Q0 1/20 0.39
SLC22A6 Q4U2R8 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1561758 0.97 FOLH1 (0.60) FOLH1CA2CA4TDP1MEN1
SCHEMBL17072184 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL17435115 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL18042480 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL11562956 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL2539262 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL17435119 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL17435139 0.95 FOLH1 (0.58) FOLH1CA2CA4TDP1MEN1
SCHEMBL2327068 0.82 FOLH1 (0.48) FOLH1CA2CA4TDP1MEN1
SCHEMBL29854920 0.80 FOLH1 (0.46) FOLH1CA2CA4TDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3296376-B1 METHOD OF POLISHING FUJIMI INC (JP) 2023-07-05 EP disclosed
EP-3366746-B1 POLISHING COMPOSITION NITTA DUPONT INCORPORATED (JP) 2023-02-22 EP disclosed
US-10748778-B2 Method for polishing silicon wafer and surface treatment composition FUJIMI INCORPORATED (JP) 2020-08-18 US disclosed
US-10696869-B2 Polishing composition NITTA HAAS INCORPORATED (JP) 2020-06-30 US disclosed
US-10435588-B2 Polishing composition NITTA HAAS INCORPORATED 2019-10-08 US disclosed
US-20190189460-A1 METHOD FOR POLISHING SILICON WAFER AND SURFACE TREATMENT COMPOSITION FUJIMI INCORPORATED (JP) 2019-06-20 US disclosed
US-20180312725-A1 POLISHING COMPOSITION NITTA HAAS INCORPORATED (JP) 2018-11-01 US disclosed
US-20180305580-A1 POLISHING COMPOSITION NITTA HAAS INCORPORATED (JP) 2018-10-25 US disclosed
EP-3366746-A1 POLISHING COMPOSITION Nitta Haas Incorporated (JP) 2018-08-29 EP disclosed
EP-3366747-A1 POLISHING COMPOSITION Nitta Haas Incorporated (JP) 2018-08-29 EP disclosed
EP-3296376-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2018-03-21 EP disclosed
US-20180030313-A1 METHOD FOR POLISHING SILICON WAFER AND SURFACE TREATMENT COMPOSITION FUJIMI INCORPORATED (JP) 2018-02-01 US disclosed
EP-3258483-A1 METHOD FOR POLISHING SILICON WAFER AND SURFACE TREATMENT COMPOSITION Fujimi Incorporated (JP) 2017-12-20 EP disclosed
US-9685343-B2 Method for producing polished object and polishing composition kit FUJIMI INCORPORATED (JP) 2017-06-20 US disclosed
US-20160189973-A1 METHOD FOR PRODUCING POLISHED OBJECT AND POLISHING COMPOSITION KIT FUJIMI INCORPORATED (JP) 2016-06-30 US disclosed
US-20090120798-A1 Method For Manufacturing Plated Resin Molded Article DAICEL POLYMER, LTD. (JP) 2009-05-14 US disclosed
EP-1840246-A1 METHOD FOR MANUFACTURING PLATED RESIN MOLTED ARTICLE Daicel Polymer Ltd. (JP) 2007-10-03 EP disclosed
EP-0403152-A2 Bleaching composition Kao Corporation (JP) 1990-12-19 EP disclosed