⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dimethylcarbate SCHEMBL15360 | 0.95 | — | — | |
| Dimethylcarbate SCHEMBL1232328 | 0.95 | — | — | |
| Dimethylcarbate SCHEMBL6868663 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL321621 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL672820 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL149386 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL10758188 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL11751711 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL3695848 | 0.91 | — | — | |
| Dimethylcarbate SCHEMBL673768 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8451011-B2 | Electrostatic capacity-type sensor | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2013-05-28 | — | — | US | disclosed |
| EP-2015043-B1 | Electrostatic capacity-type sensor | TOKAI RUBBER IND LTD (JP) | 2012-11-21 | — | — | EP | disclosed |
| US-20090015270-A1 | Electrostatic capacity-type sensor | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2009-01-15 | — | — | US | disclosed |
| EP-2015043-A2 | Electrostatic capacity-type sensor | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-6899592-B1 | Polishing apparatus and dressing method for polishing tool | EBARA CORPORATION (JP) | 2005-05-31 | — | — | US | disclosed |
| EP-1361933-A1 | POLISHING APPARATUS AND DRESSING METHOD | EBARA CORPORATION (JP) | 2003-11-19 | — | — | EP | disclosed |
| WO-2002066207-A1 | POLISHING APPARATUS AND DRESSING METHOD | EBARA CORPORATION (JP) | 2002-08-29 | — | — | WO | disclosed |