Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.86 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.86 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | MGLL | Q99685 | 2/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | PEPD | P12955 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27951389 | 1.00 | TP53 (0.86) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL28065216 | 0.95 | TP53 (0.78) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL18513488 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL25879301 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL7198838 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL8728323 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL124728 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL25878999 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL8733512 | 0.93 | TP53 (1.00) | TP53CYP3A4ALDH1A1LMNAMGLL | |
| SCHEMBL28242610 | 0.92 | TP53 (0.73) | TP53CYP3A4ALDH1A1LMNAMGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2313 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119912887-A | High-heat-conductivity low-thermal-resistance epoxy heat-conducting adhesive applied to high-power LED heat-radiating component and preparation method | 赛伦（厦门）新材料科技有限公司 | 2025-05-02 | — | — | CN | claimed |
| WO-2024216981-A1 | GEL POLYMER ELECTROLYTE AND PREPARATION METHOD THEREFOR, BATTERY, CHARGING AND DISCHARGING METHOD OF BATTERY, AND ELECTRIC DEVICE | 宁德时代新能源科技股份有限公司 | 2024-10-24 | — | — | WO | claimed |
| CN-118325077-A | Modified polyaspartic acid ester, preparation method thereof and application of modified polyaspartic acid ester in preparation of easily-constructed thick-coating type polyaspartic acid ester polyurea coating | 嘉宝莉化工集团股份有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-118272024-A | Medical glue and preparation method thereof | 东莞市高图新材料有限公司 | 2024-07-02 | — | — | CN | claimed |
| CN-118240348-A | Thermoplastic polyester elastomer with low extrusion expansion and preparation method and application thereof | 会通新材料(上海)有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118231030-A | Conductive paste, preparation method and application thereof | 比亚迪股份有限公司 | 2024-06-21 | — | — | CN | claimed |
| CN-117820811-B | High-strength high-toughness easily-degradable epoxy resin composition, preparation method and application | 中国科学院宁波材料技术与工程研究所 | 2024-06-18 | — | — | CN | claimed |
| CN-118185046-A | Preparation method of self-repairing material based on reinforced and toughened covalent organic framework filler | 安徽工业大学 | 2024-06-14 | — | — | CN | claimed |
| CN-118165478-A | Polymer composite material based on chain scission-dynamic crosslinking strategy and preparation method and application thereof | 江南大学 | 2024-06-11 | — | — | CN | claimed |
| CN-118126556-A | Preparation method of intrinsic antibacterial material | 浙江世瑞骐碳科技有限公司 | 2024-06-04 | — | — | CN | claimed |
| CN-1505672-A | Method for adhering substrates using light activatable adhesive film | 3M | 2004-06-16 | — | — | CN | claimed |
| US-20040094264-A1 | Connecting circuits using a light activatable anisotropically conductive adhesive film | 3M INNOVATIVE PROPERTIES COMPANY | 2004-05-20 | — | — | US | claimed |
| CN-1489609-A | Gel coat composition | 范蒂科股份公司 | 2004-04-14 | — | — | CN | claimed |
| CN-1121447-C | Hydrophobic epoxide resin system | VANDIK AG (CH) | 2003-09-17 | — | — | CN | claimed |
| CN-1078903-C | Powder coating | CIBA GEIGY (CH) | 2002-02-06 | — | — | CN | claimed |
| CN-1329642-A | hydrophobic epoxy resin system | VANDIK AG (CH) | 2002-01-02 | — | — | CN | claimed |
| CN-1038686-C | Solid compositions of polyglycidyl compounds having a molecular weight of less than 1500 | CIBA GEIGY AG (CH) | 1998-06-10 | — | — | CN | claimed |
| CN-1154392-A | Powder coating | CIBA GEIGY AG (CH) | 1997-07-16 | — | — | CN | claimed |
| CN-1070925-A | Molecular weight is less than the solids composition of 1500 multi-shrinking glyceryl compound | CIBA GEIGY AG (CH) | 1993-04-14 | — | — | CN | claimed |
| US-5188903-A | Coatings | THE DOW CHEMICAL COMPANY (US) | 1993-02-23 | — | — | US | claimed |