Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL429473

C1=C2CCC(C1)C2.N.N

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15663 0.97
SCHEMBL6071615 0.94
SCHEMBL11618219 0.94
SCHEMBL29878809 0.94
Methane SCHEMBL4558430 0.94
SCHEMBL23199234 0.94
SCHEMBL539983 0.94
SCHEMBL8744575 0.94
SCHEMBL8773572 0.94
SCHEMBL29570820 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 382 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218170-A1 POLYIMIDE RESIN COMPOSITION, POLYIMIDE-BASED ADHESIVE COMPOSITION, POLYIMIDE ADHESIVE FILM, AND FLEXIBLE METAL CLAD LAMINATE FILM NEXFLEX CO., LTD. (KR) 2024-07-04 US claimed
CN-112292413-B Method for producing diisocyanate and optical lens 宇利精密化学株式会社 2022-09-20 CN claimed
CN-112292413-A Method for producing diisocyanate and optical lens 宇利精密化学株式会社 2021-01-29 CN claimed
JP-11153800-A None JP disclosed
CN-122094914-A Zeolite, resin composition, liquid sealing agent, underfill material, method for producing sealing material, and electronic device 2026-05-26 CN disclosed
EP-4306566-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE ADEKA CORP (JP) 2026-05-06 EP disclosed
EP-4011978-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-11-19 EP disclosed
US-20250333565-A1 CHEMICAL-RESISTANT PROTECTIVE FILM NISSAN CHEMICAL CORPORATION (JP) 2025-10-30 US disclosed
EP-3785905-B1 POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE MOLDED ARTICLE, AND METHODS RESPECTIVELY FOR PRODUCING SAID PRODUCTS DAINIPPON INK & CHEMICALS (JP) 2025-08-13 EP disclosed
EP-3275935-B1 EPOXY RESIN COMPOSITION ADEKA CORP (JP) 2025-07-23 EP disclosed
CN-116249732-B Polyimide resin composition and molded article 三菱瓦斯化学株式会社 2025-06-24 CN disclosed
US-6881477-B2 Reacting m-xylylenediamine and adipic acid; for producing a diffusion-restricting layer for oxygen and/or carbon dioxide in beer bottles EMS-CHEMIE AG (CH) 2005-04-19 US disclosed
US-6784280-B1 DOES NOT NECESSITATE A PH-ADJUSTING STEP (DOES NOT USE A SPECIAL PH-ADJUSTING AGENT) AND PERMITS THE REACTION OF A POLYSUCCINIMIDE (CO)POLYMER WITH A LEWIS BASE AT A TEMPERATURES WITHIN A WIDE RANGE NIPPON SHOKUBAI CO., LTD. (JP) 2004-08-31 US disclosed
US-20040062988-A1 Nanoscale solid-state polymeric battery system UNIVERSITY OF MARYLAND, COLLEGE PARK, THE 2004-04-01 US disclosed
US-20030091823-A1 Reacting m-xylylenediamine and adipic acid; for producing a diffusion-restricting layer for oxygen and/or carbon dioxide in beer bottles EMS-CHEMIE AG (CH) 2003-05-15 US disclosed
WO-2002035619-A1 NANOSCALE SOLID-STATE POLYMERIC BATTERY SYSTEM UNIVERSITY OF MARYLAND COLLEGE PARK (US) 2002-05-02 WO disclosed
EP-1120433-A1 POLYSUCCINIMIDE (CO)POLYMER DERIVATIVE AND PROCESS FOR PRODUCING THE SAME Nippon Shokubai Co., Ltd. (JP) 2001-08-01 EP disclosed
US-6207794-B1 USING PHOSPHAZENIUM CATALYST MITSUI CHEMICAL, INC. (JP) 2001-03-27 US disclosed
JP-H11153800-A SEALING AGENT FOR LIQUID CRYSTAL DISPLAY ELEMENT AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SEALING AGENT RICOH CO LTD 1999-06-08 JP disclosed
EP-0916686-A1 POLYOXYALKYLENEPOLYOLS, DERIVATIVES THEREOF, AND PROCESS FOR PRODUCING THE POLYOXYALKYLENEPOLYOLS Mitsui Chemicals, Inc. (JP) 1999-05-19 EP disclosed