Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL429473

C1=C2CCC(C1)C2.N.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15663 0.97 — —
Methane SCHEMBL4558430 0.94 — —
SCHEMBL8744575 0.94 — —
SCHEMBL6071615 0.94 — —
SCHEMBL8773572 0.94 — —
SCHEMBL23199234 0.94 — —
SCHEMBL11618219 0.94 — —
SCHEMBL539983 0.94 — —
SCHEMBL29878809 0.94 — —
SCHEMBL29570820 0.94 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 382 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218170-A1 POLYIMIDE RESIN COMPOSITION, POLYIMIDE-BASED ADHESIVE COMPOSITION, POLYIMIDE ADHESIVE FILM, AND FLEXIBLE METAL CLAD LAMINATE FILM NEXFLEX CO., LTD. (KR) 2024-07-04 — — US claimed
CN-112292413-B Method for producing diisocyanate and optical lens 宇利精密化学株式会社 2022-09-20 — — CN claimed
CN-112292413-A Method for producing diisocyanate and optical lens 宇利精密化学株式会社 2021-01-29 — — CN claimed
JP-11153800-A — — None — — JP disclosed
CN-122094914-A Zeolite, resin composition, liquid sealing agent, underfill material, method for producing sealing material, and electronic device — 2026-05-26 — — CN disclosed
EP-4306566-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE ADEKA CORP (JP) 2026-05-06 — — EP disclosed
EP-4011978-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-11-19 — — EP disclosed
US-20250333565-A1 CHEMICAL-RESISTANT PROTECTIVE FILM NISSAN CHEMICAL CORPORATION (JP) 2025-10-30 — — US disclosed
EP-3785905-B1 POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE MOLDED ARTICLE, AND METHODS RESPECTIVELY FOR PRODUCING SAID PRODUCTS DAINIPPON INK & CHEMICALS (JP) 2025-08-13 — — EP disclosed
EP-3275935-B1 EPOXY RESIN COMPOSITION ADEKA CORP (JP) 2025-07-23 — — EP disclosed
CN-116249732-B Polyimide resin composition and molded article 三菱瓦斯化学株式会社 2025-06-24 — — CN disclosed
US-6881477-B2 Reacting m-xylylenediamine and adipic acid; for producing a diffusion-restricting layer for oxygen and/or carbon dioxide in beer bottles EMS-CHEMIE AG (CH) 2005-04-19 — — US disclosed
US-6784280-B1 DOES NOT NECESSITATE A PH-ADJUSTING STEP (DOES NOT USE A SPECIAL PH-ADJUSTING AGENT) AND PERMITS THE REACTION OF A POLYSUCCINIMIDE (CO)POLYMER WITH A LEWIS BASE AT A TEMPERATURES WITHIN A WIDE RANGE NIPPON SHOKUBAI CO., LTD. (JP) 2004-08-31 — — US disclosed
US-20040062988-A1 Nanoscale solid-state polymeric battery system UNIVERSITY OF MARYLAND, COLLEGE PARK, THE 2004-04-01 — — US disclosed
US-20030091823-A1 Reacting m-xylylenediamine and adipic acid; for producing a diffusion-restricting layer for oxygen and/or carbon dioxide in beer bottles EMS-CHEMIE AG (CH) 2003-05-15 — — US disclosed
WO-2002035619-A1 NANOSCALE SOLID-STATE POLYMERIC BATTERY SYSTEM UNIVERSITY OF MARYLAND COLLEGE PARK (US) 2002-05-02 — — WO disclosed
EP-1120433-A1 POLYSUCCINIMIDE (CO)POLYMER DERIVATIVE AND PROCESS FOR PRODUCING THE SAME Nippon Shokubai Co., Ltd. (JP) 2001-08-01 — — EP disclosed
US-6207794-B1 USING PHOSPHAZENIUM CATALYST MITSUI CHEMICAL, INC. (JP) 2001-03-27 — — US disclosed
JP-H11153800-A SEALING AGENT FOR LIQUID CRYSTAL DISPLAY ELEMENT AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SEALING AGENT RICOH CO LTD 1999-06-08 — — JP disclosed
EP-0916686-A1 POLYOXYALKYLENEPOLYOLS, DERIVATIVES THEREOF, AND PROCESS FOR PRODUCING THE POLYOXYALKYLENEPOLYOLS Mitsui Chemicals, Inc. (JP) 1999-05-19 — — EP disclosed
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