SCHEMBL429653

SCHEMBL429653

CC[Si](CC)(OC(C)(C)C)OC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL717225 0.88
SCHEMBL718224 0.88
SCHEMBL716591 0.83
SCHEMBL5834361 0.83
SCHEMBL717203 0.83
SCHEMBL5833996 0.79
SCHEMBL5833236 0.79
SCHEMBL13089469 0.77
SCHEMBL14790658 0.77
SCHEMBL428952 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 343 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10991571-B2 High temperature atomic layer deposition of silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2021-04-27 US claimed
US-20190189431-A1 High Temperature Atomic Layer Deposition of Silicon Oxide Thin Films VERSUM MATERIALS US, LLC (US) 2019-06-20 US claimed
US-20170256399-A9 High Temperature Atomic Layer Deposition Of Silicon Oxide Thin Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2017-09-07 US claimed
US-20160365244-A1 High Temperature Atomic Layer Deposition Of Silicon Oxide Thin Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-12-15 US claimed
US-20130295779-A1 HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC 2013-11-07 US claimed
EP-2650399-A2 High temperature atomic layer deposition of silicon oxide thin films AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-16 EP claimed
US-20250188609-A1 SEAM-FREE AND CRACK-FREE DEPOSITION LAM RES CORP (US) 2025-06-12 US disclosed
US-20250038003-A1 LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS LAM RESEARCH CORPORATION (US) 2025-01-30 US disclosed
US-20250014890-A1 CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF LAM RESEARCH CORPORATION 2025-01-09 US disclosed
CN-119213529-A Seamless and crack-free deposition 朗姆研究公司 2024-12-27 CN disclosed
WO-2024243002-A1 LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF SILICON OXIDE LAM RESEARCH CORPORATION (US) 2024-11-28 WO disclosed
US-20240262964-A1 METHOD OF PRODUCING SILICONE POLYMER TORAY FINE CHEMICALS CO., LTD. (JP) 2024-08-08 US disclosed
CN-118402040-A Low temperature molybdenum deposition assisted by silicon-containing reactants 朗姆研究公司 2024-07-26 CN disclosed
EP-1117102-A2 Method of manufacturing material for forming insulating film JSR Corporation (JP) 2001-07-18 EP disclosed
US-6235101-B1 SILICON HYDROLYZATE, METAL CHELATE, ORGANIC SOLVENT AND BETA DIKETONE FOR FILMS JSR CORPORATION (JP) 2001-05-22 US disclosed
EP-1090967-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-11 EP disclosed
EP-1088868-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-04 EP disclosed
EP-1058274-A1 Composition for film formation and material for insulating film formation JSR Corporation (JP) 2000-12-06 EP disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
EP-0921561-A2 Composition for film formation and film JSR Corporation (JP) 1999-06-09 EP disclosed