Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 3/20 | 0.70 |
| ▸ | MGAM | O43451 | 2/20 | 0.70 |
| ▸ | SI | P14410 | 2/20 | 0.70 |
| ▸ | MGAM2 | Q2M2H8 | 2/20 | 0.70 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.42 |
| ▸ | SOAT1 | P35610 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 1/20 | 0.39 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | CA9 | Q16790 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL429584 | 1.00 | GAA (0.70) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL429620 | 1.00 | GAA (0.70) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL428066 | 1.00 | GAA (0.70) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL28159162 | 0.97 | GAA (0.67) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL1330478 | 0.97 | — | — | |
| SCHEMBL1331762 | 0.97 | — | — | |
| SCHEMBL1330988 | 0.97 | — | — | |
| SCHEMBL15500 | 0.97 | — | — | |
| SCHEMBL1332259 | 0.97 | — | — | |
| SCHEMBL1331782 | 0.97 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220155688-A1 | ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2022-05-19 | — | — | US | disclosed |
| US-20200225584-A1 | ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2020-07-16 | — | — | US | disclosed |
| EP-1746122-B1 | METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE AND SEMICONDUCTOR DEVICE | JSR CORP (JP) | 2013-06-12 | — | — | EP | disclosed |
| US-8404786-B2 | Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same | JSR CORPORATION (JP) | 2013-03-26 | — | — | US | disclosed |
| EP-1705207-B1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR CORP (JP) | 2012-10-24 | — | — | EP | disclosed |
| US-20120021190-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING SILICA COATING FILM, AND APPARATUS AND MEMBER EACH COMPRISING SILICA COATING FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-26 | — | — | US | disclosed |
| US-20100168327-A1 | POLYMER AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR FORMING INSULATING FILM, AND INSULATING FILM AND METHOD OF FORMING THE SAME | JSR CORPORATION (JP) | 2010-07-01 | — | — | US | disclosed |
| EP-1972998-A1 | SILICON-CONTAINING RESIST UNDERLYING LAYER FILM FORMING COMPOSITION FOR FORMATION OF PHOTOCROSSLINKING CURED RESIST UNDERLYING LAYER FILM | Nissan Chemical Industries, Ltd. (JP) | 2008-09-24 | — | — | EP | disclosed |
| EP-1746122-A1 | METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION | JSR Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |
| EP-1746123-A1 | METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION | JSR Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |
| EP-1298176-B1 | Stacked film insulating film and substrate for semiconductor | JSR CORP (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-1295924-B1 | Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor | JSR CORP (JP) | 2006-12-13 | — | — | EP | disclosed |
| EP-1719793-A1 | POLYMER AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR FORMING INSULATING FILM, AND INSULATING FILM AND METHOD OF FORMING THE SAME | JSR Corporation (JP) | 2006-11-08 | — | — | EP | disclosed |
| EP-1705206-A1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR Corporation (JP) | 2006-09-27 | — | — | EP | disclosed |
| EP-1705207-A1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR Corporation (JP) | 2006-09-27 | — | — | EP | disclosed |
| US-6645881-B2 | Method of forming coating film, method of manufacturing semiconductor device and coating solution | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-11-11 | — | — | US | disclosed |
| US-20030139063-A1 | Method of forming coating film, method of manufacturing semiconductor device and coating solution | TOSHIBA MEMORY CORPORATION (JP) | 2003-07-24 | — | — | US | disclosed |
| EP-1298176-A2 | Stacked film insulating film and substrate for semiconductor | JSR Corporation (JP) | 2003-04-02 | — | — | EP | disclosed |
| EP-1295924-A2 | Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor | JSR Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |