SCHEMBL4297425

SCHEMBL4297425

COC(OC)[SiH2]CCCNC(N)=O

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.32
MTNR1A P48039 1/20 0.31
MTNR1B P49286 1/20 0.31
TSHR P16473 2/20 0.31
MEN1 O00255 1/20 0.30
GAA P10253 1/20 0.30
KMT2A Q03164 1/20 0.30
KDM4E B2RXH2 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1025227 0.87 TSHR (0.30) TSHR
SCHEMBL16412052 0.85 EPHX1 (0.41) EPHX1TSHRMEN1GAAKMT2A
SCHEMBL28000561 0.84 MEN1 (0.34) EPHX1TSHRMEN1GAAKMT2A
SCHEMBL8504234 0.84 EPHX1 (0.48) EPHX1TSHRMEN1GAAKMT2A
SCHEMBL1023261 0.83 TSHR (0.32) EPHX1TSHRMEN1KMT2A
SCHEMBL16422335 0.81 TSHR (0.37) EPHX1TSHRMEN1KMT2A
SCHEMBL20702307 0.80 EPHX1 (0.44) EPHX1TSHRMEN1GAAKMT2A
SCHEMBL16422436 0.79 KMT2A (0.47) EPHX1TSHRMEN1KMT2A
SCHEMBL16422231 0.78 MEN1 (0.34) EPHX1MEN1GAAKMT2A
SCHEMBL21357979 0.77 PAOX (0.32) EPHX1MTNR1AMTNR1BTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116981751-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2023-10-31 CN disclosed
CN-112739775-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-11-01 CN disclosed
CN-112739776-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-28 CN disclosed
CN-115124973-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2022-09-30 CN disclosed
CN-112739748-B Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-07-12 CN disclosed
CN-108368346-B Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2021-07-13 CN disclosed
CN-108473767-B Curable composition, method for producing curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-07-13 CN disclosed
CN-112739748-A Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
CN-112739776-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
CN-112739775-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
WO-2020067454-A1 CURABLE COMPOSITION, CURED PRODUCT AND USE OF CURABLE COMPOSITION リンテック株式会社 2020-04-02 WO disclosed
WO-2020067452-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD OF USING CURABLE COMPOSITION リンテック株式会社 2020-04-02 WO disclosed
WO-2019176828-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION リンテック株式会社 2019-09-19 WO disclosed
CN-106661328-A Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2017-05-10 CN disclosed
CN-106574115-A Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device 琳得科株式会社 2017-04-19 CN disclosed
CN-106574117-A Curable composition, method of producing curable composition, cured material, method of using curable composition, and optical device 琳得科株式会社 2017-04-19 CN disclosed
CN-106574116-A Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2017-04-19 CN disclosed
US-8349397-B2 Plastic lens, manufacturing method thereof, and manufacturing method of hard coat liquid HOYA CORPORATION (JP) 2013-01-08 US disclosed
US-20090297807-A1 PLASTIC LENS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF HARD COAT LIQUID HOYA CORPORATION (JP) 2009-12-03 US disclosed
EP-2128657-A1 Plastic lens, manufacturing method thereof, and manufacturing method of hard coat liquid Hoya Corporation (JP) 2009-12-02 EP disclosed