Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.48 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.39 |
| ▸ | THRB | P10828 | 1/20 | 0.38 |
| ▸ | ADH1B | P00325 | 1/20 | 0.38 |
| ▸ | ADH1C | P00326 | 1/20 | 0.38 |
| ▸ | ADH1A | P07327 | 1/20 | 0.38 |
| ▸ | ADH4 | P08319 | 1/20 | 0.38 |
| ▸ | ADH7 | P40394 | 1/20 | 0.38 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.37 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.35 |
| ▸ | FDPS | P14324 | 3/20 | 0.35 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.35 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11973070 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL19263699 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL10705046 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL10552173 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL25171260 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL11651644 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL25181805 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL5945372 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL10899501 | 1.00 | TSHR (0.48) | TSHRSMN1; SMN2LMNADNM1THRB | |
| SCHEMBL9090482 | 0.98 | TSHR (0.50) | TSHRSMN1; SMN2LMNADNM1THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250326926-A1 | RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2025-10-23 | — | — | US | disclosed |
| CN-119562989-A | Resin composition for molding and electronic component device | 株式会社力森诺科 | 2025-03-04 | — | — | CN | disclosed |
| WO-2025013880-A1 | MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| WO-2025013879-A1 | RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| CN-118201905-A | Cationic lipid | 武田药品工业株式会社 | 2024-06-14 | — | — | CN | disclosed |
| WO-2024111574-A1 | RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE | 株式会社レゾナック | 2024-05-30 | — | — | WO | disclosed |
| EP-4223146-A1 | SWEETENER AND FLAVOR COMPOSITIONS, METHODS OF MAKING AND METHODS OF USE THEREOF | EPC Natural Products Co., Ltd. (CN) | 2023-08-09 | — | — | EP | disclosed |
| WO-2023085299-A1 | CATIONIC LIPID | 武田薬品工業株式会社 | 2023-05-19 | — | — | WO | disclosed |
| CN-110632207-B | Method for identifying mold based on volatile gas components and evolution trend thereof | 南京财经大学 | 2022-04-29 | — | — | CN | disclosed |
| WO-2021112142-A1 | RESIN COMPOSITION FOR SEALING, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | 昭和電工マテリアルズ株式会社 | 2021-06-10 | — | — | WO | disclosed |
| CN-101042544-A | Imaging equipment, method and processing case | RICOH KK (JP) | 2007-09-26 | — | — | CN | disclosed |
| CN-101038449-A | Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor | RICOH KK (JP) | 2007-09-19 | — | — | CN | disclosed |
| CN-101025591-A | Image forming apparatus and image forming method | RICOH KK (JP) | 2007-08-29 | — | — | CN | disclosed |
| CN-1984960-A | Epoxy resin molding material for encapsulation and electronic accessory device | HITACHI CHEMICAL CO LTD (JP) | 2007-06-20 | — | — | CN | disclosed |
| CN-1972998-A | Epoxy resin molding material for sealing and electronic device | HITACHI CHEMICAL CO LTD (JP) | 2007-05-30 | — | — | CN | disclosed |
| CN-1811605-A | Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor | RICOH KK (JP) | 2006-08-02 | — | — | CN | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| CN-1639258-A | Epoxy resin composition for encapsulation and electronic component using the same | HITACHI CHEMICAL CO LTD (JP) | 2005-07-13 | — | — | CN | disclosed |
| US-4849489-A | Continuous process and system for producing polymers comprising maleic anhydride and certain alpha-olefins | S. C. JOHNSON & SON, INC. (US) | 1989-07-18 | — | — | US | disclosed |
| EP-0303057-A2 | Continous process and system for producing polymers maleic anhydride & certain alpha-olefins | S.C. JOHNSON & SON, INC. (US) | 1989-02-15 | — | — | EP | disclosed |